SCHEMBL16854080

SCHEMBL16854080

COCc1c(C)c(COC)c(O)c(COC)c1C

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
IGF1R P08069 1/20 0.48
SRC P12931 1/20 0.48
AXL P30530 1/20 0.48
PTK2 Q05397 1/20 0.48
AURKB Q96GD4 1/20 0.48
ALK Q9UM73 1/20 0.48
HPGD P15428 1/20 0.36
HSD17B10 Q99714 1/20 0.36
PRKCE Q02156 3/20 0.35
MYLK Q15746 2/20 0.35
MEN1 O00255 1/20 0.35
ALDH1A1 P00352 1/20 0.35
PRKCG P05129 1/20 0.35
MAPT P10636 1/20 0.35
PRKCA P17252 1/20 0.35
APEX1 P27695 1/20 0.35
RECQL P46063 1/20 0.35
KMT2A Q03164 1/20 0.35
TDP1 Q9NUW8 1/20 0.35
CYP3A4 P08684 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19600597 0.87 IGF1R (0.41) IGF1RSRCAXLPTK2AURKB
SCHEMBL9685153 0.86 IGF1R (0.41) IGF1RSRCAXLPTK2AURKB
SCHEMBL16850504 0.84 IGF1R (0.42) IGF1RSRCAXLPTK2AURKB
SCHEMBL16850514 0.83 IGF1R (0.45) IGF1RSRCAXLPTK2AURKB
SCHEMBL14031843 0.80 IGF1R (0.50) IGF1RSRCAXLPTK2AURKB
SCHEMBL5527566 0.80 IGF1R (0.42) IGF1RSRCAXLPTK2AURKB
SCHEMBL16318102 0.80 IGF1R (0.39) IGF1RSRCAXLPTK2AURKB
SCHEMBL14031539 0.77 IGF1R (0.40) IGF1RSRCAXLPTK2AURKB
SCHEMBL10608963 0.75 IGF1R (0.42) IGF1RSRCAXLPTK2AURKB
SCHEMBL9813429 0.73 IGF1R (0.44) IGF1RSRCAXLPTK2AURKB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4398285-A1 ADHESIVE COMPOSITION, MULTILAYER BODY, AND METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE Nissan Chemical Corporation (JP) 2024-07-10 EP disclosed
US-20230298923-A1 MULTILAYER BODY, RELEASE AGENT COMPOSITION, AND METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE NISSAN CHEMICAL CORPORATION (JP) 2023-09-21 US disclosed
US-20230298923-A1 MULTILAYER BODY, RELEASE AGENT COMPOSITION, AND METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE NISSAN CHEMICAL CORPORATION (JP) 2023-09-21 US disclosed
WO-2023132229-A1 ADHESIVE AGENT COMPOSITION, LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURING PROCESSED SUBSTRATE 日産化学株式会社 2023-07-13 WO disclosed
US-20230143007-A1 MULTILAYER OBJECT AND RELEASE AGENT COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2023-05-11 US disclosed
US-20230143007-A1 MULTILAYER OBJECT AND RELEASE AGENT COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2023-05-11 US disclosed
WO-2023008207-A1 LAYERED BODY MANUFACTURING METHOD, AND KIT FOR ADHESIVE COMPOSITION 日産化学株式会社 2023-02-02 WO disclosed
US-9405188-B2 Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and display device SAMSUNG SDI CO., LTD. (KR) 2016-08-02 US disclosed
US-20150177617-A1 Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Display Device SAMSUNG SDI CO., LTD. (KR) 2015-06-25 US disclosed