SCHEMBL1636048

SCHEMBL1636048

O=C(O)c1ccc(Oc2ccc(C(c3ccc(Oc4ccc(C(=O)O)cc4)cc3)(C(F)(F)F)C(F)(F)F)cc2)cc1

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PARP15 Q460N3 1/20 0.55
PARP10 Q53GL7 1/20 0.55
SRD5A2 P31213 6/20 0.53
FAAH O00519 1/20 0.51
EPHX2 P34913 1/20 0.51
TSHR P16473 3/20 0.46
ALDH1A1 P00352 1/20 0.46
HSD17B10 Q99714 1/20 0.46
CA1 P00915 1/20 0.46
CA2 P00918 1/20 0.46
MAPK14 Q16539 1/20 0.44
ESR1 P03372 1/20 0.44
ESR2 Q92731 1/20 0.44
RXRA P19793 2/20 0.43
RXRB P28702 2/20 0.43
NR4A2 P43354 1/20 0.43
RXRG P48443 1/20 0.43
HPGD P15428 1/20 0.43
HTT P42858 1/20 0.43
SMN1; SMN2 Q16637 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9740386 1.00 PARP15 (0.55) PARP15PARP10SRD5A2FAAHEPHX2
SCHEMBL8921736 0.92 PARP15 (0.50) PARP15PARP10SRD5A2FAAHEPHX2
SCHEMBL8923504 0.90 PARP15 (0.51) PARP15PARP10SRD5A2FAAHEPHX2
SCHEMBL336470 0.89 SRD5A2 (0.61) SRD5A2EPHX2TSHRALDH1A1CA1
SCHEMBL16429183 0.88 AKR1C3 (0.62) PARP15PARP10SRD5A2ALDH1A1MAPK14
SCHEMBL9742817 0.87 SRD5A2 (0.68) PARP15PARP10SRD5A2ALDH1A1SMN1; SMN2
Hydrochloric Acid SCHEMBL19837805 0.87 SRD5A2 (0.59) SRD5A2EPHX2TSHRALDH1A1CA1
Hydrochloric Acid SCHEMBL8505603 0.87 SRD5A2 (0.59) SRD5A2EPHX2TSHRALDH1A1CA1
SCHEMBL21656834 0.86 PARP15 (0.55) PARP15PARP10SRD5A2FAAHEPHX2
SCHEMBL21656465 0.86 PARP15 (0.55) PARP15PARP10SRD5A2FAAHEPHX2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 59 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0317944-A2 Polymers prepared from 4,4'-bis-(2-(amino (halo) phenoxyphenyl) hexafluoroisopropyl) diphenyl ether HOECHST CELANESE CORPORATION (US) 1989-05-31 EP claimed
US-20230323030-A1 Polyamide, Polyamide-Imide, Derivatives of These, Optical Film, Display Device, and Production Methods Therefor CENTRAL GLASS COMPANY, LIMITED (JP) 2023-10-12 US disclosed
US-20230303480-A1 Polybenzoxazole, Polyamide, Polyamide Solution, Insulating Material for High-Frequency Electronic Component, High-Frequency Electronic Component, High-Frequency Equipment, Insulating Material for Producing High-Frequency Electronic Component, Method for Producing Polyamide, Method for Producing Polybenzoxazole, Method for Producing Insulating Material for High-Frequency Electronic Component, and Diamine or Salt Thereof CENTRAL GLASS COMPANY, LIMITED (JP) 2023-09-28 US disclosed
US-20230287178-A1 Fluorinated Diamine or Salt Thereof, Method for Producing Fluorinated Diamine or Salt Thereof, Polyamide, Method for Producing Polyamide, Polyamide Solution, Cyclized Polyamide, Method for Producing Cyclized Polyamide, Insulation for High-Frequency Electronic Component, Method for Producing Insulation for High-Frequency Electronic Component, High-Frequency Electronic Component, High-Frequency Appliance, and Insulating Material for Producing High-Frequency Electronic Component CENTRAL GLASS COMPANY, LIMITED (JP) 2023-09-14 US disclosed
EP-4194482-A1 POLYBENZOXAZOLE, POLYAMIDE, POLYAMIDE SOLUTION, INSULATION FOR HIGH-FREQUENCY ELECTRONIC COMPONENT, HIGH-FREQUENCY ELECTRONIC COMPONENT, HIGH-FREQUENCY EQUIPMENT, INSULATION MATERIAL FOR PRODUCING HIGH-FREQUENCY ELECTRONIC COMPONENT, METHOD FOR PRODUCING POLYAMIDE, METHOD FOR PRODUCING POLYBENZOXAZOLE, METHOD FOR PRODUCING INSULATION FOR HIGH-FREQUENCY ELECTRONIC COMPONENT, AND DIAMINE OR SALT THEREOF Central Glass Company, Limited (JP) 2023-06-14 EP disclosed
EP-4190768-A1 FLUORINATED DIAMINE OR SALT THEREOF, METHOD FOR PRODUCING FLUORINATED DIAMINE OR SALT THEREOF, POLYAMIDE, METHOD FOR PRODUCING POLYAMIDE, POLYAMIDE SOLUTION, CYCLIZED POLYAMIDE, METHOD FOR PRODUCING CYCLIZED POLYAMIDE, INSULATING MATERIAL FOR HIGH-FREQUENCY ELECTRONIC COMPONENT, METHOD FOR PRODUCING INSULATING MATERIAL FOR HIGH-FREQUENCY ELECTRONIC COMPONENT, HIGH-FREQUENCY ELECTRONIC COMPONENT, HIGH-FREQUENCY APPLIANCE, AND INSULATING MATERIAL FOR PRODUCING HIGH-FREQUENCY ELECTRONIC COMPONENT Central Glass Company, Limited (JP) 2023-06-07 EP disclosed
EP-4163319-A1 POLYAMIDE, POLYAMIDE-IMIDE, DERIVATIVES OF THESE, OPTICAL FILM, DISPLAY DEVICE, AND PRODUCTION METHODS THEREFOR Central Glass Company, Limited (JP) 2023-04-12 EP disclosed
US-10087284-B2 Fluorine-containing polymerizable monomer and polymer compound using same CENTRAL GLASS COMPANY, LIMITED (JP) 2018-10-02 US disclosed
US-20170088666-A1 Fluorine-Containing Polymerizable Monomer and Polymer Compound Using Same CENTRAL GLASS COMPANY, LIMITED (JP) 2017-03-30 US disclosed
US-9550711-B2 Fluorine-containing polymerizable monomer and polymer compound using same CENTRAL GLASS COMPANY, LIMITED (JP) 2017-01-24 US disclosed
US-5109107-A Excellent flow properties and hydrolytic stability HOECHT CELANESE CORP. (US) 1992-04-28 US disclosed
US-5037949-A Fluorine containing polyamides, polyimides HOECHST CELANESE CORP. (US) 1991-08-06 US disclosed
US-4978734-A HEAT AND SOLVENT RESISTANT, PROCESSABLE; FILMS HOECHST CELANESE CORP. (US) 1990-12-18 US disclosed
EP-0397024-A1 Polyamide polymers having 12-f fluorine-containing linking groups HOECHST CELANESE CORPORATION (US) 1990-11-14 EP disclosed
EP-0397022-A2 Polyimide-Polyamide polymers having fluorine-containing linking groups HOECHST CELANESE CORPORATION (US) 1990-11-14 EP disclosed
US-4962181-A FROM AROMATIC ETHER-CONTAINING DIAMINES; HEAT RESISTANCE, STABILITY, STRENGTH, WORKABILITY; FOR FILMS HOECHST CELANESE CORP. (US) 1990-10-09 US disclosed
US-4962183-A HEAT, OXIDATION AND SOLVENT RESISTANCE; MOLDING MATERIALS; MELT PROCESSIBILITY; FIBERS, FILMS AND SHEETS HOECHST CELANESE CORP. (US) 1990-10-09 US disclosed
EP-0387061-A2 Novel polyamide-polyamide and polybenzoxazole-polyamide polymers HOECHST CELANESE CORPORATION (US) 1990-09-12 EP disclosed
US-4925915-A FLUORINE CONTAINING POLYIMIDES HOECHST CELANESE CORP. (US) 1990-05-15 US disclosed
EP-0317944-A2 Polymers prepared from 4,4'-bis-(2-(amino (halo) phenoxyphenyl) hexafluoroisopropyl) diphenyl ether HOECHST CELANESE CORPORATION (US) 1989-05-31 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20230303480-A1 Polybenzoxazole, Polyamide, Polyamide Solution, Insulating Material for High-Frequency Electronic Component, High-Frequency Electronic Component, High-Frequency Equipment, Insulating Material for Producing High-Frequency Electronic Component, Method for Producing Polyamide, Method for Producing Polybenzoxazole, Method for Producing Insulating Material for High-Frequency Electronic Component, and Diamine or Salt Thereof PUF60, TET1, PBRM1 PARP15 1526/4885PARP10 2121/4885SRD5A2 2160/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.