SCHEMBL1637157

SCHEMBL1637157

CCO[SiH](OCC)C1CCC([SiH](OCC)OCC)CC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27485262 1.00
SCHEMBL27717542 0.89
SCHEMBL1562371 0.89
SCHEMBL9334081 0.88 SMYD3 (0.30)
SCHEMBL319607 0.87 SHBG (0.32)
SCHEMBL1315982 0.87 SHBG (0.32)
SCHEMBL2861326 0.82
SCHEMBL3742136 0.76 PPM1B (0.32)
SCHEMBL19927410 0.76
SCHEMBL27522928 0.73

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7098149-B2 Mechanical enhancement of dense and porous organosilicate materials by UV exposure AIR PRODUCTS AND CHEMICALS, INC. (US) 2006-08-29 US claimed
EP-3231892-B1 MECHANICAL ENHANCEMENT OF DENSE AND POROUS ORGANOSILICATE MATERIALS BY UV EXPOSURE VERSUM MAT US LLC (US) 2020-08-05 EP disclosed
EP-3231892-A1 MECHANICAL ENHANCEMENT OF DENSE AND POROUS ORGANOSILICATE MATERIALS BY UV EXPOSURE Versum Materials US, LLC (US) 2017-10-18 EP disclosed
EP-1457583-B1 Mechanical enhancement of dense and porous organosilicate materials by UV exposure AIR PROD & CHEM (US) 2017-05-31 EP disclosed
US-20130260575-A1 SILICON PRECURSORS AND COMPOSITIONS COMPRISING SAME FOR DEPOSITING LOW DIELECTRIC CONSTANT FILMS AIR PRODUCTS AND CHEMICALS, INC. (US) 2013-10-03 US disclosed
US-8293001-B2 Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants AIR PRODUCTS AND CHEMICALS, INC. (US) 2012-10-23 US disclosed
US-20110143032-A1 Porogens, Porogenated Precursors and Methods for Using the Same to Provide Porous Organosilica Glass Films With Low Dielectric Constants AIR PRODUCTS AND CHEMICALS, INC. (US) 2011-06-16 US disclosed
US-7932188-B2 Mechanical enhancement of dense and porous organosilicate materials by UV exposure AIR PRODUCTS AND CHEMICALS, INC. (US) 2011-04-26 US disclosed
US-20090054674-A1 Mechanical Enhancement of Dense and Porous Organosilicate Materials by UV Exposure AIR PRODUCTS AND CHEMICALS, INC. (US) 2009-02-26 US disclosed
US-7468290-B2 Mechanical enhancement of dense and porous organosilicate materials by UV exposure AIR PRODUCTS AND CHEMICALS, INC. (US) 2008-12-23 US disclosed
EP-1873818-A2 Process for curing dielectric films Air Products and Chemicals, Inc. (US) 2008-01-02 EP disclosed
EP-1561841-A2 Cleaning CVD Chambers following deposition of porogen-containing materials AIR PRODUCTS AND CHEMICALS, INC. (US) 2005-08-10 EP disclosed
US-20050161060-A1 Cleaning CVD chambers following deposition of porogen-containing materials AIR PRODUCTS AND CHEMICALS, INC. 2005-07-28 US disclosed
EP-1457583-A2 Mechanical enhancement of dense and porous organosilicate materials by UV exposure AIR PRODUCTS AND CHEMICALS, INC. (US) 2004-09-15 EP disclosed
US-20040175501-A1 Mechanical enhancement of dense and porous organosilicate materials by UV exposure VERSUM MATERIALS US, LLC 2004-09-09 US disclosed