SCHEMBL16390481

SCHEMBL16390481

CCC(CCCOCC1CO1)OCC1CO1

nearest known ligand 0.58

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 1/20 0.58
TSHR P16473 2/20 0.55
ALDH1A1 P00352 4/20 0.54
TDP1 Q9NUW8 1/20 0.54
MAPK1 P28482 1/20 0.38
PDK1 Q15118 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16632796 0.95 TSHR (0.58) SMN1; SMN2TSHRALDH1A1TDP1MAPK1
SCHEMBL16424382 0.94 ALDH1A1 (0.60) SMN1; SMN2TSHRALDH1A1TDP1MAPK1
SCHEMBL16424215 0.94 ALDH1A1 (0.60) SMN1; SMN2TSHRALDH1A1TDP1MAPK1
SCHEMBL16424451 0.94 ALDH1A1 (0.60) SMN1; SMN2TSHRALDH1A1TDP1MAPK1
SCHEMBL16424471 0.90 SMN1; SMN2 (0.52) SMN1; SMN2TSHRALDH1A1TDP1MAPK1
SCHEMBL7136103 0.89 ALDH1A1 (0.55) SMN1; SMN2TSHRALDH1A1TDP1MAPK1
SCHEMBL16423693 0.89 SMN1; SMN2 (0.61) SMN1; SMN2TSHRALDH1A1TDP1MAPK1
SCHEMBL16424051 0.89 SMN1; SMN2 (0.66) SMN1; SMN2TSHRALDH1A1TDP1MAPK1
SCHEMBL16424050 0.87 ALDH1A1 (0.65) SMN1; SMN2TSHRALDH1A1TDP1MAPK1
SCHEMBL7136102 0.87 ALDH1A1 (0.52) SMN1; SMN2TSHRALDH1A1TDP1PDK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114456548-B Organic/inorganic hybrid flame retardant, preparation method thereof and flame-retardant HDPE composite material 湖北中烟工业有限责任公司 2023-09-12 CN claimed
CN-114456548-A Organic/inorganic hybrid flame retardant, preparation method thereof and flame-retardant HDPE composite material 湖北中烟工业有限责任公司 2022-05-10 CN claimed
CN-117461127-A Liquid compression molding material, electronic component, semiconductor device, and method for manufacturing semiconductor device 纳美仕有限公司 2024-01-26 CN disclosed
CN-114456548-B Organic/inorganic hybrid flame retardant, preparation method thereof and flame-retardant HDPE composite material 湖北中烟工业有限责任公司 2023-09-12 CN disclosed
CN-112912415-B Reaction products of diglycidyl ethers with difunctional active hydrogen-containing components and hydrophobic components 赫尔克里士有限公司 2023-08-08 CN disclosed
WO-2023047702-A1 LIQUID COMPRESSION MOLDING MATERIAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE ナミックス株式会社 2023-03-30 WO disclosed
CN-114456548-A Organic/inorganic hybrid flame retardant, preparation method thereof and flame-retardant HDPE composite material 湖北中烟工业有限责任公司 2022-05-10 CN disclosed
CN-114456548-A Organic/inorganic hybrid flame retardant, preparation method thereof and flame-retardant HDPE composite material 湖北中烟工业有限责任公司 2022-05-10 CN disclosed
CN-112912415-A Reaction products of diglycidyl ethers with difunctional active hydrogen-containing components and hydrophobic components 赫尔克里士有限公司 2021-06-04 CN disclosed
CN-107383377-B Cyclic polycaprolactone-polyethylene glycol amphiphilic block copolymer, and preparation and application thereof 苏州大学 2020-08-04 CN disclosed
EP-3489269-A1 Use of a multi-component mortar mass on an epoxide amine basis Hilti Aktiengesellschaft (LI) 2019-05-29 EP disclosed
US-20160159690-A1 Use of an Epoxide-Amine-Based Multicomponent Mortar Composition HILTI AKTIENGESELLSCHAFT (LI) 2016-06-09 US disclosed
CN-105623592-A Flexible insulation pouring sealant based on modified epoxy resin NANJING AILU NEW ENERGY TECH CO LTD 2016-06-01 CN disclosed
CN-103087665-B High-heat-conductivity insulation low-viscosity epoxy resin pouring sealant and preparation method thereof UNIV HEFEI TECHNOLOGY 2015-05-06 CN disclosed
US-20150104651-A1 EPOXY RESIN, METHOD FOR PRODUCING EXPOXY RESIN, EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, AND HEAT-DISSIPATING RESIN MATERIAL DIC CORPORATION (JP) 2015-04-16 US disclosed
EP-2832759-A1 EPOXY RESIN, METHOD FOR PRODUCING EPOXY RESIN, EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, AND HEAT-DISSIPATING RESIN MATERIAL DIC Corporation (JP) 2015-02-04 EP disclosed
EP-2826796-A1 Use of a multi-component mortar mass on an epoxide amine basis HILTI Aktiengesellschaft (LI) 2015-01-21 EP disclosed
EP-2826798-A1 Use of a multi-component mortar mass on an epoxide amine basis HILTI Aktiengesellschaft (LI) 2015-01-21 EP disclosed
EP-2826797-A1 Hardener components, mortar mass containing the same and their use HILTI Aktiengesellschaft (LI) 2015-01-21 EP disclosed
CN-103087665-A High-heat-conductivity insulation low-viscosity epoxy resin pouring sealant and preparation method thereof UNIV HEFEI TECHNOLOGY 2013-05-08 CN disclosed