SCHEMBL16423955

SCHEMBL16423955

C(OCC1CO1)C1CO1.CCCCCCC(O)CCO

nearest known ligand 0.54

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.54
TDP1 Q9NUW8 1/20 0.54
SMN1; SMN2 Q16637 1/20 0.49
FFAR4 Q5NUL3 1/20 0.39
FFAR1 O14842 1/20 0.39
PSMD14 O00487 2/20 0.39
PLA2G1B P04054 2/20 0.39
MMP2 P08253 2/20 0.39
ATG4B Q9Y4P1 2/20 0.39
HSP90AA1 P07900 1/20 0.39
RAD52 P43351 1/20 0.39
TSHR P16473 1/20 0.38
GPR84 Q9NQS5 5/20 0.37
ENPP2 Q13822 1/20 0.36
LPAR2 Q9HBW0 1/20 0.36
USP2 O75604 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16423893 1.00 ALDH1A1 (0.54) ALDH1A1TDP1SMN1; SMN2FFAR4FFAR1
SCHEMBL16423738 0.98 ALDH1A1 (0.51) ALDH1A1TDP1SMN1; SMN2FFAR4FFAR1
SCHEMBL16424102 0.94 ALDH1A1 (0.54) ALDH1A1TDP1SMN1; SMN2FFAR4FFAR1
SCHEMBL16424398 0.94 ALDH1A1 (0.54) ALDH1A1TDP1SMN1; SMN2TSHRENPP2
SCHEMBL16423872 0.92 ALDH1A1 (0.51) ALDH1A1TDP1SMN1; SMN2FFAR4FFAR1
SCHEMBL16424049 0.92 ALDH1A1 (0.51) ALDH1A1TDP1SMN1; SMN2FFAR4FFAR1
SCHEMBL16423886 0.91 ALDH1A1 (0.51) ALDH1A1TDP1SMN1; SMN2FFAR4FFAR1
SCHEMBL731320 0.89 ALDH1A1 (0.56) ALDH1A1TDP1SMN1; SMN2TSHRGPR84
SCHEMBL16423838 0.89 ALDH1A1 (0.53) ALDH1A1TDP1SMN1; SMN2FFAR4PSMD14
SCHEMBL6306571 0.89 ALDH1A1 (0.56) ALDH1A1TDP1SMN1; SMN2TSHRGPR84

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2832759-B1 EPOXY RESIN, METHOD FOR PRODUCING EPOXY RESIN, EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, AND HEAT-DISSIPATING RESIN MATERIAL DAINIPPON INK & CHEMICALS (JP) 2017-03-15 EP disclosed
US-9441069-B2 Epoxy resin, method for producing epoxy resin, epoxy resin composition, cured product thereof, and heat-dissipating resin material DIC CORPORATION (JP) 2016-09-13 US disclosed
CN-104220477-B The manufacture method of epoxy resin, epoxy resin, composition epoxy resin, its cured article and heat radiation resin material DIC CORP. (JP) 2015-11-25 CN disclosed
US-20150104651-A1 EPOXY RESIN, METHOD FOR PRODUCING EXPOXY RESIN, EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, AND HEAT-DISSIPATING RESIN MATERIAL DIC CORPORATION (JP) 2015-04-16 US disclosed
EP-2832759-A1 EPOXY RESIN, METHOD FOR PRODUCING EPOXY RESIN, EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, AND HEAT-DISSIPATING RESIN MATERIAL DIC Corporation (JP) 2015-02-04 EP disclosed
CN-104220477-A Epoxy resin, method for producing epoxy resin, epoxy resin composition, cured product thereof, and heat-dissipating resin material DAINIPPON INK & CHEMICALS 2014-12-17 CN disclosed