Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.61 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.57 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.57 |
| ▸ | TSHR | P16473 | 2/20 | 0.48 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.37 |
| ▸ | PDK1 | Q15118 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11363694 | 0.95 | ALDH1A1 (0.60) | SMN1; SMN2ALDH1A1TDP1TSHRMAPK1 | |
| SCHEMBL16423894 | 0.94 | ALDH1A1 (0.63) | SMN1; SMN2ALDH1A1TDP1TSHRMAPK1 | |
| SCHEMBL16423956 | 0.94 | ALDH1A1 (0.63) | SMN1; SMN2ALDH1A1TDP1TSHRMAPK1 | |
| SCHEMBL16424051 | 0.94 | SMN1; SMN2 (0.66) | SMN1; SMN2ALDH1A1TDP1TSHRMAPK1 | |
| SCHEMBL16423840 | 0.92 | ALDH1A1 (0.65) | SMN1; SMN2ALDH1A1TDP1TSHRMAPK1 | |
| SCHEMBL16423888 | 0.91 | ALDH1A1 (0.68) | SMN1; SMN2ALDH1A1TDP1TSHRMAPK1 | |
| SCHEMBL16423570 | 0.90 | SMN1; SMN2 (0.55) | SMN1; SMN2ALDH1A1TDP1TSHRMAPK1 | |
| SCHEMBL16423873 | 0.89 | ALDH1A1 (0.70) | SMN1; SMN2ALDH1A1TDP1TSHRMAPK1 | |
| SCHEMBL16424050 | 0.89 | ALDH1A1 (0.65) | SMN1; SMN2ALDH1A1TDP1TSHRMAPK1 | |
| SCHEMBL16424103 | 0.88 | ALDH1A1 (0.68) | SMN1; SMN2ALDH1A1TDP1TSHRMAPK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2832759-B1 | EPOXY RESIN, METHOD FOR PRODUCING EPOXY RESIN, EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, AND HEAT-DISSIPATING RESIN MATERIAL | DAINIPPON INK & CHEMICALS (JP) | 2017-03-15 | — | — | EP | disclosed |
| US-9441069-B2 | Epoxy resin, method for producing epoxy resin, epoxy resin composition, cured product thereof, and heat-dissipating resin material | DIC CORPORATION (JP) | 2016-09-13 | — | — | US | disclosed |
| US-20150104651-A1 | EPOXY RESIN, METHOD FOR PRODUCING EXPOXY RESIN, EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, AND HEAT-DISSIPATING RESIN MATERIAL | DIC CORPORATION (JP) | 2015-04-16 | — | — | US | disclosed |
| EP-2832759-A1 | EPOXY RESIN, METHOD FOR PRODUCING EPOXY RESIN, EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, AND HEAT-DISSIPATING RESIN MATERIAL | DIC Corporation (JP) | 2015-02-04 | — | — | EP | disclosed |