Predicted protein targets (top 3)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.32 |
| ▸ | LMNA | P02545 | 1/20 | 0.32 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL131295 | 0.86 | ALDH1A1 (0.41) | ALDH1A1LMNAHSD17B10 | |
| SCHEMBL7171913 | 0.77 | ALDH1A1 (0.35) | ALDH1A1LMNAHSD17B10 | |
| SCHEMBL6698494 | 0.76 | TSHR (0.33) | ALDH1A1LMNAHSD17B10 | |
| SCHEMBL3818137 | 0.76 | ALDH1A1 (0.33) | ALDH1A1LMNAHSD17B10 | |
| SCHEMBL203518 | 0.75 | ALDH1A1 (0.44) | ALDH1A1LMNAHSD17B10 | |
| SCHEMBL23529413 | 0.75 | ALDH1A1 (0.36) | ALDH1A1LMNAHSD17B10 | |
| SCHEMBL9293827 | 0.75 | ALDH1A1 (0.36) | ALDH1A1LMNAHSD17B10 | |
| SCHEMBL18496506 | 0.74 | HSD17B10 (0.37) | ALDH1A1LMNAHSD17B10 | |
| SCHEMBL28253061 | 0.74 | ALDH1A1 (0.39) | ALDH1A1LMNAHSD17B10 | |
| SCHEMBL3890711 | 0.73 | ALDH1A1 (0.40) | ALDH1A1LMNAHSD17B10 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-109689791-B | Curable particulate silicon composition, semiconductor member comprising same, and method for molding same | 道康宁东丽株式会社 | 2022-09-16 | — | — | CN | disclosed |
| US-11136437-B2 | Curable particulate silicone composition, semiconductor member comprising curable particulate silicone composition, and method for molding semiconductor member | DOW TORAY CO., LTD. (JP) | 2021-10-05 | — | — | US | disclosed |
| EP-3498779-A1 | CURABLE PARTICULATE SILICONE COMPOSITION, SEMICONDUCTOR MEMBER COMPRISING CURABLE PARTICULATE SILICONE COMPOSITION, AND MOLDING METHOD FOR SEMICONDUCTOR MEMBER COMPRISING CURABLE PARTICULATE SILICONE COMPOSITION | Dow Corning Toray Co., Ltd. (JP) | 2019-06-19 | — | — | EP | disclosed |
| US-20190177488-A1 | CURABLE PARTICULATE SILICONE COMPOSITION, SEMICONDUCTOR MEMBER COMPRISING CURABLE PARTICULATE SILICONE COMPOSITION, AND METHOD FOR MOLDING SEMICONDUCTOR MEMBER | DOW CORNING TORAY CO., LTD. (JP) | 2019-06-13 | — | — | US | disclosed |
| US-20170306201-A1 | ADHESIVE COMPOSITIONS AND USES THEREOF | DOW TORAY CO., LTD. (JP) | 2017-10-26 | — | — | US | disclosed |
| US-20170194539-A1 | Layered Polymer Structures And Methods | DOW CORNING CORPORATION (US) | 2017-07-06 | — | — | US | disclosed |
| US-9006356-B2 | Curable compositions of resin-linear organosiloxane block copolymers | DOW CORNING CORPORATION (US) | 2015-04-14 | — | — | US | disclosed |
| US-20150045486-A1 | CURABLE COMPOSITIONS OF RESIN-LINEAR ORGANOSILOXANE BLOCK COPOLYMERS | DOW CORNING CORPORATION | 2015-02-12 | — | — | US | disclosed |