SCHEMBL16459455

SCHEMBL16459455

CCCC=CC[SiH](OCC)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5808016 0.86 LPAR3 (0.36)
SCHEMBL22472132 0.83 FAAH (0.47)
SCHEMBL22472129 0.83 FAAH (0.47)
SCHEMBL16458874 0.83 FAAH (0.47)
SCHEMBL22472147 0.83 FAAH (0.47)
SCHEMBL22472123 0.83 FAAH (0.47)
SCHEMBL3337770 0.80
SCHEMBL11729340 0.79
SCHEMBL6063110 0.78
SCHEMBL927329 0.76 TDP1 (0.38)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20140102332-A1 FUNCTIONAL REINFORCING FILLERS MODIFIED WITH ALKENYLALKOXYSILANE AND PREPARING METHOD OF THE SAME KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) 2014-04-17 US claimed
WO-2025023143-A1 GLASS CLOTH TREATMENT LIQUID AND SURFACE TREATED GLASS CLOTH 信越化学工業株式会社 2025-01-30 WO disclosed
US-20220153583-A1 BULK BORON NITRIDE PARTICLES, THERMALLY CONDUCTIVE RESIN COMPOSITION, AND HEAT DISSIPATING MEMBER DENKA COMPANY LIMITED (JP) 2022-05-19 US disclosed
WO-2020196644-A1 BULK BORON NITRIDE PARTICLES, THERMALLY CONDUCTIVE RESIN COMPOSITION, AND HEAT DISSIPATING MEMBER デンカ株式会社 2020-10-01 WO disclosed
US-9127167-B2 Functional reinforcing fillers modified with alkenylalkoxysilane and preparing method of the same KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) 2015-09-08 US disclosed
US-20140102332-A1 FUNCTIONAL REINFORCING FILLERS MODIFIED WITH ALKENYLALKOXYSILANE AND PREPARING METHOD OF THE SAME KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) 2014-04-17 US disclosed