SCHEMBL16468542

SCHEMBL16468542

CC1CCC(C)N1C(=O)C1CCCCC1

nearest known ligand 0.88

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
▸ RECQL P46063 1/20 0.88
▸ TSHR P16473 2/20 0.61
▸ GAA P10253 1/20 0.57
▸ ALDH1A1 P00352 2/20 0.52
▸ HSD11B1 P28845 7/20 0.47
▸ MAPT P10636 1/20 0.45
▸ LMNA P02545 1/20 0.44
▸ CES2 O00748 1/20 0.44
▸ CES1 P23141 1/20 0.44
▸ HSD11B2 P80365 2/20 0.44
▸ CNR1 P21554 1/20 0.43
▸ SMN1; SMN2 Q16637 1/20 0.43
▸ HPGD P15428 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1515238 0.98 RECQL (0.83) RECQLTSHRGAAALDH1A1HSD11B1
SCHEMBL16468180 0.93 RECQL (1.00) RECQLTSHRGAAALDH1A1HSD11B1
SCHEMBL24322396 0.84 RECQL (0.69) RECQLTSHRGAAALDH1A1HSD11B1
SCHEMBL9667146 0.77 TSHR (0.96) RECQLTSHRGAAALDH1A1HSD11B1
SCHEMBL9667551 0.74 GAA (0.95) RECQLTSHRGAAALDH1A1HSD11B1
SCHEMBL16254880 0.72 TSHR (0.66) RECQLTSHRGAAALDH1A1HSD11B1
SCHEMBL9093412 0.72 TSHR (0.66) RECQLTSHRGAAALDH1A1HSD11B1
SCHEMBL25824927 0.72 RECQL (0.55) RECQLTSHRGAAALDH1A1HSD11B1
SCHEMBL19386636 0.71 RECQL (0.53) RECQLTSHRGAAALDH1A1HSD11B1
SCHEMBL27209297 0.71 RECQL (0.53) RECQLTSHRGAAMAPTHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119955091-A Polymer, positive-type negative-type photosensitive resin composition, pattern forming method, cured film forming method, interlayer insulating film, surface protective film, and electronic component 信越化学工业株式会社 2025-05-09 — — CN disclosed
CN-118210199-A Photosensitive resin composition, cured film pattern, and method for producing same 奇美实业股份有限公司 2024-06-18 — — CN disclosed
CN-115113484-A Positive photosensitive resin composition, positive photosensitive dry film, method for producing the same, and method for forming pattern 信越化学工业株式会社 2022-09-27 — — CN disclosed
CN-107561863-B Positive photosensitive resin composition and application thereof 奇美实业股份有限公司 2022-09-16 — — CN disclosed
CN-114253069-A Photosensitive resin composition, pattern forming method, cured film forming method, interlayer insulating film, and surface protective film 信越化学工业株式会社 2022-03-29 — — CN disclosed
US-10162260-B2 Photosensitive resin composition, protective film, and liquid crystal display element CHI MEI CORPORATION (TW) 2018-12-25 — — US disclosed
CN-107561863-A Positive photosensitive resin composition and application thereof 奇美实业股份有限公司 2018-01-09 — — CN disclosed
CN-106909028-A Photosensitive resin composition, protective film and liquid crystal display element 奇美实业股份有限公司 2017-06-30 — — CN disclosed
US-20170168390-A1 PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, AND LIQUID CRYSTAL DISPLAY ELEMENT CHI MEI CORPORATION (TW) 2017-06-15 — — US disclosed
US-20150293449-A1 PHOTOSENSITIVE POLYSILOXANE COMPOSITION AND USES THEREOF CHI MEI CORPORATION (TW) 2015-10-15 — — US disclosed
CN-104950580-A Photosensitive polysiloxane composition and application thereof CHI MEI CORP 2015-09-30 — — CN disclosed
CN-104375381-A Photosensitive polysiloxane composition, film formed by photosensitive polysiloxane composition and device comprising film CHI MEI CORP 2015-02-25 — — CN disclosed
US-20150050596-A1 PHOTOSENSITIVE POLYSILOXANE COMPOSITION AND USES THEREOF CHI MEI CORPORATION (TW) 2015-02-19 — — US disclosed
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