SCHEMBL1648858

SCHEMBL1648858

CC1CC2OC2CC1(C(=O)O)C1(C(=O)O)CC2OC2CC1C

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 3/20 0.36
MAPK1 P28482 2/20 0.36
TP53 P04637 2/20 0.36
NFKB1 P19838 2/20 0.36
THPO P40225 2/20 0.36
GMNN O75496 2/20 0.36
PMP22 Q01453 2/20 0.36
CYP2C19 P33261 1/20 0.36
STAT6 P42226 1/20 0.36
HIF1A Q16665 1/20 0.36
NPC1 O15118 1/20 0.36
MTOR P42345 1/20 0.36
RAB9A P51151 1/20 0.36
BLM P54132 1/20 0.36
SMN1; SMN2 Q16637 1/20 0.36
NPSR1 Q6W5P4 1/20 0.36
PPP1CA P62136 1/20 0.34
PPP5C P53041 1/20 0.32
KDM4E B2RXH2 1/20 0.31
TFPI2 P48307 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7156989 0.91 MAPK1 (0.37) LMNAMAPK1TP53NFKB1THPO
SCHEMBL26119771 0.84 MAPK1 (0.33) LMNAMAPK1TP53NFKB1THPO
SCHEMBL11859679 0.82 LMNA (0.42) LMNAMAPK1TP53NFKB1THPO
SCHEMBL9175228 0.76 MAPK1 (0.33) LMNAMAPK1TP53NFKB1THPO
SCHEMBL7172049 0.72 LMNA (0.38) LMNAMAPK1TP53NFKB1THPO
SCHEMBL214269 0.72 PPP5C (0.34) LMNAMAPK1TP53NFKB1THPO
SCHEMBL7553800 0.71 MAPK1 (0.33) LMNAMAPK1TP53NFKB1THPO
SCHEMBL187543 0.69 PPP5C (0.32) PPP5C
SCHEMBL27586251 0.69
Bicarbonate SCHEMBL3791150 0.68 MAPK1 (0.34) LMNAMAPK1TP53NFKB1THPO

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117645771-A Solvent-free high-low temperature resistant bulletproof composite matrix resin and preparation method thereof 上海鑫丰泰新材料科技有限公司 2024-03-05 CN claimed
CN-113480829-A Low-viscosity epoxy/episulfide resin composition and epoxy/episulfide matrix resin 牧世复合材料科技(苏州)有限公司 2021-10-08 CN disclosed
CN-110484180-A The low warpage hardened glue of high-flexibility high rigidity, hardening protective film and preparation method ZHANGJIAGANG KANGDE XIN OPTRONICS MAT CO LTD 2019-11-22 CN disclosed
US-9266309-B2 Method of producing gas-barrier laminated member TOYO SEIKAN KAISHA, LTD. (JP) 2016-02-23 US disclosed
EP-2103640-B1 COMPOSITION FOR FORMING GAS BARRIER MATERIAL, GAS BARRIER MATERIAL AND METHOD FOR PRODUCING THE SAME, AND GAS BARRIER PACKAGING MATERIAL TOYO SEIKAN KAISHA LTD (JP) 2015-11-11 EP disclosed
US-20110200836-A1 GAS-BARRIER MATERIAL HAVING EXCELLENT ANTI-BLOCKING PROPERTY AND METHOD OF PRODUCING THE SAME TOYO SEIKAN KAISHA, LTD. (JP) 2011-08-18 US disclosed
US-20110091743-A1 METHOD OF PRODUCING GAS-BARRIER LAMINATED MEMBER TOYO SEIKAN KAISHA, LTD. (JP) 2011-04-21 US disclosed
EP-2193915-A1 GAS-BARRIER MATERIAL WITH EXCELLENT BLOCKING RESISTANCE AND PROCESS FOR PRODUCING THE SAME TOYO SEIKAN KAISYA, LTD. (JP) 2010-06-09 EP disclosed
EP-2103640-A1 COMPOSITION FOR FORMING GAS BARRIER MATERIAL, GAS BARRIER MATERIAL AND METHOD FOR PRODUCING THE SAME, AND GAS BARRIER PACKAGING MATERIAL TOYO SEIKAN KAISYA, LTD. (JP) 2009-09-23 EP disclosed