SCHEMBL16499595

SCHEMBL16499595

N=C(N)N[SiH]1CCCCO1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL543024 0.81
SCHEMBL2355549 0.72
SCHEMBL2491293 0.72
SCHEMBL29078804 0.68
SCHEMBL7783164 0.68 TSHR (0.32)
SCHEMBL4257894 0.67
SCHEMBL16754901 0.67
SCHEMBL1397139 0.67
SCHEMBL28516476 0.67
SCHEMBL8857957 0.66

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116200072-B Preparation method of water-based priming ink applied to metal base material 浙江浦江永进工贸有限公司 2023-10-13 CN claimed
CN-114958084-B Preparation method of low-viscosity high-solid-content anti-offset composite ink for flexography 浙江浦江永进工贸有限公司 2023-09-29 CN claimed
CN-116200072-A Preparation method of water-based priming ink applied to metal base material 浙江浦江永进工贸有限公司 2023-06-02 CN claimed
CN-114958084-A Preparation method of low-viscosity high-solid-content anti-fouling composite ink for flexography 浙江浦江永进工贸有限公司 2022-08-30 CN claimed
CN-116200072-B Preparation method of water-based priming ink applied to metal base material 浙江浦江永进工贸有限公司 2023-10-13 CN disclosed
CN-114958084-B Preparation method of low-viscosity high-solid-content anti-offset composite ink for flexography 浙江浦江永进工贸有限公司 2023-09-29 CN disclosed
CN-116200072-A Preparation method of water-based priming ink applied to metal base material 浙江浦江永进工贸有限公司 2023-06-02 CN disclosed
CN-114958084-A Preparation method of low-viscosity high-solid-content anti-fouling composite ink for flexography 浙江浦江永进工贸有限公司 2022-08-30 CN disclosed
EP-2840087-B1 USE OF COMPOUNDS CONTAINING SEMI-ORGANIC SILICON GROUPS WITH GUANIDINE GROUPS FOR CURING OF COMPOUNDS CONTAINING ALKOXYSILYL GROUPS EVONIK DEGUSSA GMBH (DE) 2019-04-10 EP disclosed
US-9790327-B2 Silicone resin compositions which can be cured at room temperature EVONIK DEGUSSA GMBH (DE) 2017-10-17 US disclosed
US-20160208050-A1 SILICONE RESIN COMPOSITIONS WHICH CAN BE CURED AT ROOM TEMPERATURE EVONIK DEGUSSA GMBH (DE) 2016-07-21 US disclosed
EP-3036273-A1 SILICONE RESIN COMPOSITIONS WHICH CAN BE CURED AT ROOM TEMPERATURE Evonik Degussa GmbH (DE) 2016-06-29 EP disclosed
US-9353225-B2 Compounds having guanidine groups and containing semi-organic silicon groups EVONIK DEGUSSA GMBH (DE) 2016-05-31 US disclosed
WO-2015024813-A1 SILICONE RESIN COMPOSITIONS WHICH CAN BE CURED AT ROOM TEMPERATURE EVONIK INDUSTRIES AG (DE) 2015-02-26 WO disclosed
US-20150057412-A1 COMPOUNDS HAVING GUANIDINE GROUPS AND CONTAINING SEMI-ORGANIC SILICON GROUPS EVONIK DEGUSSA GMBH (DE) 2015-02-26 US disclosed
EP-2840087-A1 Compounds containing semi-organic silicon groups with guanidine groups Evonik Degussa GmbH (DE) 2015-02-25 EP disclosed