⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Formic Acid SCHEMBL4302038 | 0.93 | ALDH1A1 (0.38) | — | |
| Formic Acid SCHEMBL3583984 | 0.88 | — | — | |
| Formic Acid SCHEMBL673683 | 0.86 | ALDH1A1 (0.33) | — | |
| Formic Acid SCHEMBL734324 | 0.86 | ALDH1A1 (0.33) | — | |
| Formic Acid SCHEMBL337949 | 0.86 | ALDH1A1 (0.33) | — | |
| Formic Acid SCHEMBL7632313 | 0.86 | — | — | |
| Formic Acid SCHEMBL7796505 | 0.86 | — | — | |
| Formic Acid SCHEMBL21268119 | 0.86 | ALDH1A1 (0.33) | — | |
| Formic Acid SCHEMBL20636861 | 0.86 | — | — | |
| Formic Acid SCHEMBL887020 | 0.86 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 133 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250354267-A1 | HIGH-TEMPERATURE RESISTANT NANO-COPPER PRODUCED BY LASER DIRECT WRITING, PREPARATION METHOD AND APPLICATION THEREOF | ZHEJIANG UNIVERSITY (CN) | 2025-11-20 | — | — | US | claimed |
| CN-118437937-B | Laser direct writing high-temperature-resistant nano copper and preparation method and application thereof | 浙江大学 | 2025-04-22 | — | — | CN | claimed |
| CN-119789747-A | Perovskite precursor solution, perovskite solar cell, preparation method of perovskite solar cell and photovoltaic module | 天合光能股份有限公司 | 2025-04-08 | — | — | CN | claimed |
| EP-3677704-B1 | ANTICORROSION TREATMENT METHOD FOR COPPER-CONTAINING MATERIAL | UNIV XIAMEN (CN) | 2024-10-09 | — | — | EP | claimed |
| CN-118437937-A | Laser direct writing high-temperature-resistant nano copper and preparation method and application thereof | 浙江大学 | 2024-08-06 | — | — | CN | claimed |
| US-11982002-B2 | Method for anti-corrosion treatment of metallic copper-containing materials | XIAMEN UNIVERSITY (CN) | 2024-05-14 | — | — | US | claimed |
| CN-117123271-A | Nickel catalyst and preparation method thereof | 厦门大学 | 2023-11-28 | — | — | CN | claimed |
| CN-111799012-B | Antioxidant copper material and preparation method thereof | 厦门铜乐科技有限公司 | 2023-02-28 | — | — | CN | claimed |
| US-11559715-B2 | Antifreeze compositions | QUADSIL, INC. (US) | 2023-01-24 | — | — | US | claimed |
| CN-114182231-B | Substrate processing-based hexagonal boron nitride film preparation method | 厦门大学 | 2023-01-24 | — | — | CN | claimed |
| CN-107513311-B | Antioxidant copper-graphene composite conductive ink and preparation method thereof | 厦门大学 | 2020-03-06 | — | — | CN | claimed |
| US-20170203136-A1 | ANTIFREEZE COMPOSITIONS | QUADSIL, INC. | 2017-07-20 | — | — | US | claimed |
| EP-2081679-B1 | CATALYST FOR XYLENE ISOMERIZATION AND PROCESS FOR PREPARING THE SAME | SK INNOVATION CO LTD (KR) | 2016-01-27 | — | — | EP | claimed |
| US-8030239-B2 | Catalyst for xylene isomerization and process for preparing the same | SK ENERGY CO., LTD. (KR) | 2011-10-04 | — | — | US | claimed |
| US-20100048381-A1 | CATALYST FOR XYLENE ISOMERIZATION AND PROCESS FOR PREPARING THE SAME | SK ENERGY CO., LTD. (KR) | 2010-02-25 | — | — | US | claimed |
| EP-2081679-A1 | CATALYST FOR XYLENE ISOMERIZATION AND PROCESS FOR PREPARING THE SAME | SK Energy Co., Ltd. (KR) | 2009-07-29 | — | — | EP | claimed |
| WO-2008060117-A1 | CATALYST FOR XYLENE ISOMERIZATION AND PROCESS FOR PREPARING THE SAME | SK ENERGY CO., LTD. (KR) | 2008-05-22 | — | — | WO | claimed |
| US-20070074717-A1 | Heating recycling system for regenerating the absorptive materials | AKOS ADVANCED TECHNOLOGY LIMITED (HK) | 2007-04-05 | — | — | US | claimed |
| US-6652770-B2 | For prevention of the increase of temperature in heat sensitive devices through the absorption of heat during heat generating conditions | HAYES CLAUDE Q C (US) | 2003-11-25 | — | — | US | claimed |
| US-6261475-B1 | THERMOSENSITIVE ELEMENTS | HAYES CLAUDE Q C (US) | 2001-07-17 | — | — | US | claimed |