SCHEMBL16527353

SCHEMBL16527353

C[C](CP(=O)(O)O)P(=O)(O)O

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.43
LMNA P02545 1/20 0.43
HPGD P15428 1/20 0.43
TSHR P16473 1/20 0.43
BLM P54132 1/20 0.43
KMT2A Q03164 1/20 0.43
TDP1 Q9NUW8 1/20 0.43
PGK1 P00558 1/20 0.43
PGK2 P07205 1/20 0.43
ENO1 P06733 1/20 0.38
KDM4E B2RXH2 1/20 0.37
MMP2 P08253 1/20 0.37
THRB P10828 1/20 0.37
MAPK1 P28482 1/20 0.37
HSD17B10 Q99714 1/20 0.37
GRIN2D O15399 1/20 0.35
GRIN3B O60391 1/20 0.35
GRIN1 Q05586 1/20 0.35
GRIN2A Q12879 1/20 0.35
GRIN2B Q13224 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL491391 0.76
SCHEMBL10882405 0.71
SCHEMBL144420 0.71
SCHEMBL5775798 0.71
SCHEMBL19211975 0.69 MEN1 (0.38) MEN1LMNAHPGDTSHRBLM
SCHEMBL19211973 0.69 MEN1 (0.38) MEN1LMNAHPGDTSHRBLM
SCHEMBL300621 0.69
SCHEMBL28642991 0.69
Fosfonet SCHEMBL347045 0.67 MEN1 (0.82) MEN1LMNAHPGDTSHRBLM
SCHEMBL483074 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230109597-A1 CLEANING COMPOSITION FUJIMI INCORPORATED (JP) 2023-04-06 US disclosed
US-20210395645-A1 CLEANING LIQUID FUJIFILM ELECTRONIC MATERIALS CO., LTD. (JP) 2021-12-23 US disclosed
US-11203731-B2 Composition for surface treatment and method of producing the same, surface treatment method, and method of producing semiconductor substrate FUJIMI INCORPORATED (JP) 2021-12-21 US disclosed
US-20210130735-A1 COMPOSITION FOR SURFACE TREATMENT AND METHOD OF PRODUCING THE SAME, SURFACE TREATMENT METHOD, AND METHOD OF PRODUCING SEMICONDUCTOR SUBSTRATE FUJIMI INCORPORATED (JP) 2021-05-06 US disclosed
US-10954479-B2 Composition for surface treatment and surface treatment method using the same FUJIMI INCORPORATED 2021-03-23 US disclosed
WO-2020195343-A1 CLEANING LIQUID 富士フイルムエレクトロニクスマテリアルズ株式会社 2020-10-01 WO disclosed
US-20200308450-A1 POLISHING COMPOSITION FUJIMI INCORPORATED (JP) 2020-10-01 US disclosed
WO-2019181269-A1 GERMANIUM DISSOLUTION INHIBITOR 株式会社フジミインコーポレーテッド 2019-09-26 WO disclosed
US-20190241842-A1 COMPOSITION FOR SURFACE TREATMENT AND SURFACE TREATMENT METHOD USING THE SAME FUJIMI INCORPORATED (JP) 2019-08-08 US disclosed
US-9845538-B2 Etching agent, etching method and etching agent preparation liquid WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2017-12-19 US disclosed
US-9803161-B2 Cleaning agent for semiconductor substrates and method for processing semiconductor substrate surface WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2017-10-31 US disclosed
US-20160177457-A1 ETCHING AGENT, ETCHING METHOD AND ETCHING AGENT PREPARATION LIQUID WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2016-06-23 US disclosed
US-20150140820-A1 CLEANING AGENT FOR SEMICONDUCTOR SUBSTRATES AND METHOD FOR PROCESSING SEMICONDUCTOR SUBSTRATE SURFACE WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2015-05-21 US disclosed
EP-2843689-A1 CLEANING AGENT FOR SEMICONDUCTOR SUBSTRATES AND METHOD FOR PROCESSING SEMICONDUCTOR SUBSTRATE SURFACE Wako Pure Chemical Industries, Ltd. (JP) 2015-03-04 EP disclosed