⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1657752 | 0.97 | — | — | |
| SCHEMBL1656670 | 0.94 | — | — | |
| SCHEMBL1902417 | 0.94 | — | — | |
| SCHEMBL1903342 | 0.94 | — | — | |
| SCHEMBL4974745 | 0.80 | — | — | |
| SCHEMBL191489 | 0.77 | — | — | |
| Propane SCHEMBL11757451 | 0.77 | CYP3A4 (0.40) | — | |
| Butane SCHEMBL10702549 | 0.77 | CYP3A4 (0.40) | — | |
| SCHEMBL681190 | 0.77 | — | — | |
| SCHEMBL258983 | 0.77 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2023146152-A1 | THERMOPLASTIC RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND MOLDED ARTICLE MANUFACTURED THEREFROM | (주) 엘지화학 | 2023-08-03 | — | — | WO | disclosed |
| US-10731002-B2 | Semiaromatic copolyamide resin and polyamide molding composition consisting of the same | KINGFA SCI. & TECH. CO., LTD. (CN) | 2020-08-04 | — | — | US | disclosed |
| EP-3339351-B1 | SEMIAROMATIC COPOLYAMIDE RESIN AND POLYAMIDE MOLDING COMPOSITION CONSISTING OF THE SAME | KINGFA SCIENCE & TECHNOLOGY CO (CN) | 2020-06-10 | — | — | EP | disclosed |
| US-20190002638-A1 | SEMIAROMATIC POLYAMIDE RESIN AND PREPARATION METHOD THEREOF AND POLYAMIDE MOLDING COMPOSITION CONSISTING OF THE SAME | KINGFA SCI. & TECH. CO., LTD. (CN) | 2019-01-03 | — | — | US | disclosed |
| US-20190002639-A1 | SEMIAROMATIC COPOLYAMIDE RESIN AND POLYAMIDE MOLDING COMPOSITION CONSISTING OF THE SAME | KINGFA SCI. & TECH. CO., LTD. (CN) | 2019-01-03 | — | — | US | disclosed |
| EP-3375821-A1 | SEMI-AROMATIC POLYAMIDE RESIN, METHOD FOR PREPARING SAME, AND POLYAMIDE MOLDING COMPOSITION CONSISTING OF SAME | Zuhai Vanteque Specialty Engineering Plastics Co., Ltd. (CN) | 2018-09-19 | — | — | EP | disclosed |
| EP-3339351-A1 | SEMI-AROMATIC COPOLYAMIDE RESIN AND POLYAMIDE MOLDING COMPOSITION CONSISTING OF SEMI-AROMATIC COPOLYAMIDE RESIN | Kingfa Sci. & Tech. Co., Ltd. (CN) | 2018-06-27 | — | — | EP | disclosed |
| US-8796367-B2 | Thermoplastic polyester resin composition | MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) | 2014-08-05 | — | — | US | disclosed |
| US-8338511-B2 | Thermoplastic polyester resin composition | MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) | 2012-12-25 | — | — | US | disclosed |
| EP-2308927-B1 | THERMOPLASTIC POLYESTER RESIN COMPOSITION | MITSUBISHI ENG PLASTICS CORP (JP) | 2012-06-06 | — | — | EP | disclosed |
| EP-2314643-B1 | THERMOPLASTIC POLYESTER RESIN COMPOSITION | MITSUBISHI ENG PLASTICS CORP (JP) | 2012-05-16 | — | — | EP | disclosed |
| US-20110201730-A1 | THERMOPLASTIC POLYESTER RESIN COMPOSITION | MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) | 2011-08-18 | — | — | US | disclosed |
| US-20110200811-A1 | FLAME-RETARDANT POLYBUTYLENE TEREPHTHALATE SERIES RESIN COMPOSITION | MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) | 2011-08-18 | — | — | US | disclosed |
| US-20110184101-A1 | THERMOPLASTIC POLYESTER RESIN COMPOSITION | MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) | 2011-07-28 | — | — | US | disclosed |
| EP-2322577-A1 | FLAME-RETARDANT POLYBUTYLENE TEREPHTHALATE-BASED RESIN COMPOSITION | Mitsubishi Engineering-Plastics Corporation (JP) | 2011-05-18 | — | — | EP | disclosed |
| EP-2314643-A1 | THERMOPLASTIC POLYESTER RESIN COMPOSITION | Mitsubishi Engineering-Plastics Corporation (JP) | 2011-04-27 | — | — | EP | disclosed |
| EP-2308927-A1 | THERMOPLASTIC POLYESTER RESIN COMPOSITION | Mitsubishi Engineering-Plastics Corporation (JP) | 2011-04-13 | — | — | EP | disclosed |