SCHEMBL258983

SCHEMBL258983

CCCCO[PH2]=O.[CaH2]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL98026 0.97 — —
SCHEMBL191489 0.94 — —
Propane SCHEMBL11757451 0.94 CYP3A4 (0.40) —
Butane SCHEMBL10702549 0.94 CYP3A4 (0.40) —
Benzene SCHEMBL11671043 0.90 LTA4H (0.39) —
SCHEMBL681190 0.89 — —
Pentadecane SCHEMBL11673241 0.86 CA1 (0.43) —
SCHEMBL1229752 0.86 CA1 (0.43) —
SCHEMBL517044 0.86 — —
Octane SCHEMBL10703294 0.86 CA1 (0.43) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113631641-B Yellow pigment composition 巴斯夫欧洲公司 2025-02-25 — — CN disclosed
US-20240158633-A1 POLYAMIDE RESIN COMPOSITION AND POLYAMIDE MOLDED BODY MITSUI CHEMICALS, INC. (JP) 2024-05-16 — — US disclosed
WO-2022124513-A1 THERMOPLASTIC RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND MOLDED PRODUCT MANUFACTURED THEREFROM (주) 엘지화학 2022-06-16 — — WO disclosed
WO-2020054705-A1 METAL-COATED MOLDED RESIN ARTICLES AND PRODUCTION METHOD THEREFOR 三菱エンジニアリングプラスチックス株式会社 2020-03-19 — — WO disclosed
US-8796367-B2 Thermoplastic polyester resin composition MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2014-08-05 — — US disclosed
US-8338511-B2 Thermoplastic polyester resin composition MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2012-12-25 — — US disclosed
EP-2308927-B1 THERMOPLASTIC POLYESTER RESIN COMPOSITION MITSUBISHI ENG PLASTICS CORP (JP) 2012-06-06 — — EP disclosed
EP-2314643-B1 THERMOPLASTIC POLYESTER RESIN COMPOSITION MITSUBISHI ENG PLASTICS CORP (JP) 2012-05-16 — — EP disclosed
US-8053500-B2 Flame-retardant polyamide resin composition and molded article MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2011-11-08 — — US disclosed
US-20110201730-A1 THERMOPLASTIC POLYESTER RESIN COMPOSITION MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2011-08-18 — — US disclosed
US-20110200811-A1 FLAME-RETARDANT POLYBUTYLENE TEREPHTHALATE SERIES RESIN COMPOSITION MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2011-08-18 — — US disclosed
US-20110184101-A1 THERMOPLASTIC POLYESTER RESIN COMPOSITION MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2011-07-28 — — US disclosed
EP-2322577-A1 FLAME-RETARDANT POLYBUTYLENE TEREPHTHALATE-BASED RESIN COMPOSITION Mitsubishi Engineering-Plastics Corporation (JP) 2011-05-18 — — EP disclosed
EP-2314643-A1 THERMOPLASTIC POLYESTER RESIN COMPOSITION Mitsubishi Engineering-Plastics Corporation (JP) 2011-04-27 — — EP disclosed
EP-2308927-A1 THERMOPLASTIC POLYESTER RESIN COMPOSITION Mitsubishi Engineering-Plastics Corporation (JP) 2011-04-13 — — EP disclosed
EP-2100919-B1 FLAME-RETARDANT POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE MITSUBISHI ENG PLASTICS CORP (JP) 2011-03-09 — — EP disclosed
US-20100069539-A1 FLAME-RETARDANT POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2010-03-18 — — US disclosed
EP-2100919-A1 FLAME-RETARDANT POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE Mitsubishi Engineering-Plastics Corporation (JP) 2009-09-16 — — EP disclosed
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