SCHEMBL16608917

SCHEMBL16608917

O=C(C1CC2CCC1C2)C(C(F)(F)F)(C(F)(F)F)S(=O)(=O)O

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
POLB P06746 1/20 0.40
L3MBTL1 Q9Y468 2/20 0.35
MEN1 O00255 2/20 0.34
KMT2A Q03164 2/20 0.34
NPC1 O15118 2/20 0.34
RAB9A P51151 2/20 0.34
HSD11B1 P28845 1/20 0.34
HPGD P15428 2/20 0.33
KCNQ3 O43525 1/20 0.33
KCNQ2 O43526 1/20 0.33
KCNQ4 P56696 1/20 0.33
KCNQ5 Q9NR82 1/20 0.33
HTT P42858 2/20 0.32
GAA P10253 1/20 0.32
THRB P10828 1/20 0.32
KDM4E B2RXH2 1/20 0.31
EPHX2 P34913 2/20 0.31
P2RX7 Q99572 1/20 0.31
HSD17B10 Q99714 1/20 0.31
ALDH1A1 P00352 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12256434 0.83 POLB (0.42) POLBL3MBTL1MEN1KMT2ANPC1
SCHEMBL16604541 0.81 POLB (0.38) POLBL3MBTL1MEN1KMT2ANPC1
SCHEMBL18408787 0.75 POLB (0.47) POLBL3MBTL1MEN1KMT2ANPC1
SCHEMBL13259998 0.75 POLB (0.41) POLBL3MBTL1MEN1KMT2ANPC1
SCHEMBL15468698 0.74 EPHX2 (0.48) HSD11B1HPGDHTTKDM4EEPHX2
SCHEMBL14389928 0.71 SCN9A (0.35) L3MBTL1MEN1KMT2ANPC1RAB9A
SCHEMBL22364001 0.71 POLB (0.38) POLBL3MBTL1MEN1KMT2ANPC1
SCHEMBL12376804 0.71 MEN1 (0.35) POLBL3MBTL1MEN1KMT2ANPC1
SCHEMBL13079566 0.71 POLB (0.38) POLBL3MBTL1MEN1KMT2ANPC1
SCHEMBL25889181 0.71 POLB (0.37) POLBL3MBTL1MEN1KMT2AHSD11B1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20150093692-A1 PATTERN FORMING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION AND RESIST FILM USED THEREFOR, AND ELECTRONIC DEVICE MANUFACTURING METHOD AND ELECTRONIC DEVICE USING THE SAMEDEVICE MANUFACTURING METHOD AND ELECTRONIC DEVICE USING THE SAME FUJIFILM CORPORATION (JP) 2015-04-02 US disclosed