Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.46 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.43 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.41 |
| ▸ | TSHR | P16473 | 2/20 | 0.40 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL16424449 | 0.98 | ALDH1A1 (0.45) | ALDH1A1SMN1; SMN2TDP1TSHRMAPK1 | |
| SCHEMBL16424381 | 0.98 | ALDH1A1 (0.45) | ALDH1A1SMN1; SMN2TDP1TSHRMAPK1 | |
| SCHEMBL16424214 | 0.98 | ALDH1A1 (0.45) | ALDH1A1SMN1; SMN2TDP1TSHRMAPK1 | |
| SCHEMBL16424568 | 0.95 | ALDH1A1 (0.47) | ALDH1A1SMN1; SMN2TDP1TSHRMAPK1 | |
| Butane SCHEMBL28029666 | 0.92 | ALDH1A1 (0.49) | ALDH1A1SMN1; SMN2TDP1TSHRMAPK1 | |
| SCHEMBL16423838 | 0.89 | ALDH1A1 (0.53) | ALDH1A1SMN1; SMN2TDP1TSHRMAPK1 | |
| SCHEMBL16423872 | 0.89 | ALDH1A1 (0.51) | ALDH1A1SMN1; SMN2TDP1TSHR | |
| SCHEMBL16423571 | 0.89 | SMN1; SMN2 (0.46) | ALDH1A1SMN1; SMN2TDP1TSHRMAPK1 | |
| 3-Octanol SCHEMBL27695453 | 0.89 | ALDH1A1 (0.55) | ALDH1A1SMN1; SMN2TDP1TSHRMAPK1 | |
| SCHEMBL16424470 | 0.88 | ALDH1A1 (0.46) | ALDH1A1SMN1; SMN2TDP1TSHRMAPK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9441069-B2 | Epoxy resin, method for producing epoxy resin, epoxy resin composition, cured product thereof, and heat-dissipating resin material | DIC CORPORATION (JP) | 2016-09-13 | — | — | US | disclosed |
| CN-104220477-B | The manufacture method of epoxy resin, epoxy resin, composition epoxy resin, its cured article and heat radiation resin material | DIC CORP. (JP) | 2015-11-25 | — | — | CN | disclosed |
| US-20150104651-A1 | EPOXY RESIN, METHOD FOR PRODUCING EXPOXY RESIN, EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, AND HEAT-DISSIPATING RESIN MATERIAL | DIC CORPORATION (JP) | 2015-04-16 | — | — | US | disclosed |
| CN-104220477-A | Epoxy resin, method for producing epoxy resin, epoxy resin composition, cured product thereof, and heat-dissipating resin material | DAINIPPON INK & CHEMICALS | 2014-12-17 | — | — | CN | disclosed |