SCHEMBL16640976

SCHEMBL16640976

CCCCN(CCC[Si](OCC)(OCC)OCC)CC1CCCC(CN(CC2CO2)CC2CO2)C1

nearest known ligand 0.30

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16640969 0.98 SMN1; SMN2 (0.30) SMN1; SMN2
SCHEMBL16641040 0.96
SCHEMBL16641048 0.94
SCHEMBL23521518 0.88 HTT (0.36) SMN1; SMN2
SCHEMBL16640954 0.84 SMN1; SMN2 (0.35) SMN1; SMN2
SCHEMBL23521519 0.83 SMN1; SMN2 (0.30) SMN1; SMN2
SCHEMBL16640958 0.82 SMN1; SMN2 (0.36) SMN1; SMN2
SCHEMBL613799 0.81 SMN1; SMN2 (0.30) SMN1; SMN2
SCHEMBL16640959 0.80 EPHX1 (0.32)
SCHEMBL23521506 0.78

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9902803-B2 Epoxy compound having alkoxy silyl group, composition comprising same, cured product, use thereof and method for preparing epoxy compound having alkoxy silyl group KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY (KR) 2018-02-27 US disclosed
US-20150105493-A1 EPOXY COMPOUND HAVING ALKOXY SILYL GROUP, COMPOSITION COMPRISING SAME, CURED PRODUCT, USE THEREOF AND METHOD FOR PREPARING EPOXY COMPOUND HAVING ALKOXY SILYL GROUP KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY (KR) 2015-04-16 US disclosed