SCHEMBL16640959

SCHEMBL16640959

CCCCCNC(=O)N(CC1CCCC(CN(CC2CO2)CC2CO2)C1)C(=O)NCCC[Si](OCC)(OCC)OCC

nearest known ligand 0.34

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
EPHX1 P07099 3/20 0.32
NAAA Q02083 1/20 0.31
TSHR P16473 1/20 0.30
METAP2 P50579 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16640977 0.90 ALOX5 (0.32)
SCHEMBL19901226 0.89 EPHX1 (0.38) EPHX1NAAAMETAP2
SCHEMBL16640974 0.85 BCHE (0.34) EPHX1
SCHEMBL16641044 0.84 OPRM1 (0.31)
SCHEMBL16640976 0.80 SMN1; SMN2 (0.30)
SCHEMBL16640975 0.80 BCHE (0.37) EPHX1NAAA
SCHEMBL16641040 0.78
SCHEMBL16641048 0.78
SCHEMBL16644971 0.78 BCHE (0.31) EPHX1
SCHEMBL16640969 0.78 SMN1; SMN2 (0.30)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9902803-B2 Epoxy compound having alkoxy silyl group, composition comprising same, cured product, use thereof and method for preparing epoxy compound having alkoxy silyl group KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY (KR) 2018-02-27 US disclosed
US-20150105493-A1 EPOXY COMPOUND HAVING ALKOXY SILYL GROUP, COMPOSITION COMPRISING SAME, CURED PRODUCT, USE THEREOF AND METHOD FOR PREPARING EPOXY COMPOUND HAVING ALKOXY SILYL GROUP KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY (KR) 2015-04-16 US disclosed