SCHEMBL16680965

SCHEMBL16680965

CC(=O)C(C)C(=O)[O-].CC(=O)C(C)C(=O)[O-].CC(=O)C(C)C(=O)[O-].CC(=O)C(C)C(=O)[O-].[Pt+4]

nearest known ligand 0.47

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
CA1 P00915 6/20 0.41
CA4 P22748 2/20 0.37
CA2 P00918 1/20 0.33
TSHR P16473 3/20 0.32
CYP3A4 P08684 2/20 0.32
NFKB1 P19838 2/20 0.32
NPSR1 Q6W5P4 2/20 0.32
ALDH1A1 P00352 1/20 0.30
TDP1 Q9NUW8 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1274727 0.94 CA1 (0.41) CA1CA4CA2TSHRCYP3A4
SCHEMBL208042 0.94 CA1 (0.41) CA1CA4CA2TSHRCYP3A4
SCHEMBL19327192 0.94 CA1 (0.41) CA1CA4CA2TSHRCYP3A4
SCHEMBL11547358 0.94 CA1 (0.41) CA1CA4CA2TSHRCYP3A4
SCHEMBL7716512 0.94 CA1 (0.41) CA1CA4CA2TSHRCYP3A4
SCHEMBL8055981 0.94 CA1 (0.41) CA1CA4CA2TSHRCYP3A4
SCHEMBL7631487 0.94 CA1 (0.41) CA1CA4CA2TSHRCYP3A4
SCHEMBL11500943 0.94 CA1 (0.41) CA1CA4CA2TSHRCYP3A4
SCHEMBL8959411 0.94 CA1 (0.41) CA1CA4CA2TSHRCYP3A4
Silver SCHEMBL527467 0.94

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9851668-B2 Fixing member, fixing device, and image forming apparatus FUJI XEROX CO., LTD. (JP) 2017-12-26 US claimed
US-20170261893-A1 FIXING MEMBER, FIXING DEVICE, AND IMAGE FORMING APPARATUS FUJI XEROX CO., LTD. (JP) 2017-09-14 US claimed
US-9365757-B2 UV-curable adhesive organopolysiloxane composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-06-14 US claimed
US-20150124338-A1 UV-CURABLE ADHESIVE ORGANOPOLYSILOXANE COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-05-07 US claimed
CN-110938309-B Silicone composition KCC有机硅株式会社 2022-08-02 CN disclosed
CN-110072697-B Laminate and electronic component manufacturing method 陶氏东丽株式会社 2022-05-03 CN disclosed
CN-109689359-B Laminate, method for producing same, and method for producing electronic component 道康宁东丽株式会社 2022-04-05 CN disclosed
CN-108884322-B Addition one-liquid heat-curable heat-conductive silicone grease composition and method for producing cured product thereof 信越化学工业株式会社 2021-08-24 CN disclosed
US-10961419-B2 Layered body and method for manufacturing electronic component DOW TORAY CO., LTD. (JP) 2021-03-30 US disclosed
CN-110938309-A Silicone composition KCC公司 2020-03-31 CN disclosed
US-20190300767-A1 LAYERED BODY AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DOW TORAY CO., LTD. (JP) 2019-10-03 US disclosed
EP-3533606-A1 LAYERED BODY AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT Dow Toray Co., Ltd. (JP) 2019-09-04 EP disclosed