SCHEMBL1668385

SCHEMBL1668385

CCCCC(CC)CO.CCCCOCCOCCO

nearest known ligand 0.64

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.64
TSHR P16473 4/20 0.61
MEN1 O00255 3/20 0.55
KMT2A Q03164 3/20 0.55
THRB P10828 1/20 0.55
HTT P42858 1/20 0.55
MAPT P10636 1/20 0.55
CYP3A4 P08684 6/20 0.46
LMNA P02545 2/20 0.44
TDP1 Q9NUW8 2/20 0.39
MMP9 P14780 1/20 0.39
MMP8 P22894 1/20 0.39
MMP14 P50281 1/20 0.39
USP2 O75604 2/20 0.39
MAPK1 P28482 1/20 0.39
CASP1 P29466 1/20 0.39
SMN1; SMN2 Q16637 1/20 0.39
SLCO1B3 Q9NPD5 1/20 0.39
SLCO1B1 Q9Y6L6 1/20 0.39
ATM Q13315 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Butoxyethanol SCHEMBL17162908 0.96 ALDH1A1 (0.64) ALDH1A1TSHRMEN1KMT2ATHRB
SCHEMBL27929287 0.93 ALDH1A1 (0.75) ALDH1A1TSHRMEN1KMT2ATHRB
Diethylene Glycol Monoethyl Ether SCHEMBL7771153 0.91 ALDH1A1 (0.62) ALDH1A1TSHRMEN1KMT2ATHRB
Octane SCHEMBL11341855 0.89 ALDH1A1 (0.69) ALDH1A1TSHRMEN1KMT2ATHRB
2-Ethoxyethanol SCHEMBL2125994 0.87 ALDH1A1 (0.67) ALDH1A1TSHRMEN1KMT2ATHRB
Propylene Glycol SCHEMBL8586272 0.86 ALDH1A1 (0.64) ALDH1A1TSHRMEN1KMT2ATHRB
SCHEMBL14470292 0.85 TSHR (0.64) ALDH1A1TSHRMEN1KMT2ATHRB
SCHEMBL4005241 0.84 CYP3A4 (0.61) ALDH1A1TSHRMEN1KMT2ATHRB
Triethylene Glycol SCHEMBL9402837 0.84 CYP3A4 (0.56) ALDH1A1TSHRMEN1KMT2ATHRB
SCHEMBL3997312 0.84 CYP3A4 (0.61) ALDH1A1TSHRMEN1KMT2ATHRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8338075-B2 Base component which exhibits increased solubility in an alkali developing solution under the action of acid, an acid generator, and organic solvent having a boiling point of at least 150 degrees C.; hole-like resist pattern can be formed with a high level of resolution and minute dimensions TOKYO OHKA KOGYO CO., LTD. (JP) 2012-12-25 US claimed
EP-2314648-B1 DISPERSION RESIN COMPOSITION, AND PAINT COMPOSITION, INK COMPOSITION, ADHESIVE COMPOSITION, AND PRIMER COMPOSITION CONTAINING SAME NIPPON PAPER CHEMICALS CO LTD (JP) 2013-07-31 EP disclosed
US-20110112229-A1 DISPERSION RESIN COMPOSITION, AND PAINT COMPOSITION, INK COMPOSITION, ADHESIVE COMPOSITION AND PRIMER COMPOSITION, CONTAINING THE DISPERSION RESIN COMPOSITION NIPPON PAPER CHEMICALS CO., LTD. (JP) 2011-05-12 US disclosed
EP-2314648-A1 DISPERSING RESIN COMPOSITION, AND PAINT COMPOSITION, INK COMPOSITION, ADHESIVE COMPOSITION, AND PRIMER COMPOSITION CONTAINING SAME Nippon Paper Chemicals Co., Ltd. (JP) 2011-04-27 EP disclosed