SCHEMBL1668449

SCHEMBL1668449

C=C1CC2CC1C1CCC(=C)C21

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29597531 0.83
SCHEMBL14890212 0.70
SCHEMBL21859048 0.67
SCHEMBL2222148 0.64
SCHEMBL28968701 0.64
SCHEMBL13939658 0.61
SCHEMBL20262287 0.60
SCHEMBL17633436 0.58
SCHEMBL13372435 0.58
SCHEMBL12463673 0.55 NLRP3 (0.39)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240141087-A1 POLYCYCLIC-OLEFINIC POLYMERS CONTAINING ACRYLATE FUNCTIONALITY WITH ACRYLATE/MALEIMIDE CROSSLINKERS AS B-STAGEABLE COMPOSITIONS FOR LOW LOSS APPLICATIONS PROMERUS, LLC (US) 2024-05-02 US claimed
US-20240141087-A1 POLYCYCLIC-OLEFINIC POLYMERS CONTAINING ACRYLATE FUNCTIONALITY WITH ACRYLATE/MALEIMIDE CROSSLINKERS AS B-STAGEABLE COMPOSITIONS FOR LOW LOSS APPLICATIONS PROMERUS, LLC (US) 2024-05-02 US disclosed
CN-114514300-B Adhesive composition, adhesive sheet, laminate, and printed wiring board 东洋纺MC株式会社 2023-11-14 CN disclosed
CN-115768626-A Adhesive composition, adhesive sheet, laminate, and printed wiring board 东洋纺株式会社 2023-03-07 CN disclosed
CN-114514300-A Adhesive composition, adhesive sheet, laminate, and printed wiring board 东洋纺株式会社 2022-05-17 CN disclosed
WO-2011039318-A1 A SILICONE RUBBER COMPOSITION AND A SILICONE RUBBER HENKEL AG & CO. KGAA (DE) 2011-04-07 WO disclosed