SCHEMBL1669393

SCHEMBL1669393

CCCN(CCC)[SiH](C)C

nearest known ligand 0.32

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
CA1 P00915 2/20 0.32
CA12 O43570 1/20 0.30
CA2 P00918 1/20 0.30
CA9 Q16790 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7625001 0.80 TSHR (0.35) CA1CA12CA2CA9
SCHEMBL14236955 0.74 CA1 (0.33) CA1CA12CA2CA9
SCHEMBL17711123 0.73
SCHEMBL31722478 0.73
SCHEMBL433963 0.69
SCHEMBL17711211 0.69
SCHEMBL31722619 0.69
SCHEMBL31722306 0.69
SCHEMBL10024716 0.69 CA1 (0.30) CA1
SCHEMBL17691290 0.69 CA1 (0.30) CA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2011048159-A1 METHOD FOR PRODUCING OLIGO- AND/OR POLYSILOXANES AND/OR N-SUBSTITUTED UREA DERIVATIVES TECHNISCHE UNIVERSITÄT BERGAKADEMIE FREIBERG (DE) 2011-04-28 WO claimed
US-20250308910-A1 SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM Kokusai Electric Corporation (JP) 2025-10-02 US disclosed
US-20240112907-A1 METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, RECORDING MEDIUM, AND SUBSTRATE PROCESSING APPARATUS Kokusai Electric Corporation (JP) 2024-04-04 US disclosed
EP-4343814-A1 METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PROGRAM, AND SUBSTRATE PROCESSING APPARATUS Kokusai Electric Corp. (JP) 2024-03-27 EP disclosed
CN-117766384-A Substrate processing method, semiconductor device manufacturing method, substrate processing system, and recording medium 株式会社国际电气 2024-03-26 CN disclosed
CN-117766374-A Substrate processing method, semiconductor device manufacturing method, substrate processing system, and recording medium 株式会社国际电气 2024-03-26 CN disclosed
CN-117702084-A Substrate processing method, semiconductor device manufacturing method, substrate processing apparatus, and recording medium 株式会社国际电气 2024-03-15 CN disclosed
US-20240030026-A1 PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PROCESSING APPARATUS, AND RECORDING MEDIUM Kokusai Electric Corporation (JP) 2024-01-25 US disclosed
CN-117253819-A Substrate processing method, semiconductor device manufacturing method, substrate processing apparatus, and recording medium 株式会社国际电气 2023-12-19 CN disclosed
CN-117121172-A Method for manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and program 株式会社国际电气 2023-11-24 CN disclosed
WO-2022264430-A1 SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING DEVICE, AND PROGRAM 株式会社KOKUSAI ELECTRIC 2022-12-22 WO disclosed
WO-2011048159-A1 METHOD FOR PRODUCING OLIGO- AND/OR POLYSILOXANES AND/OR N-SUBSTITUTED UREA DERIVATIVES TECHNISCHE UNIVERSITÄT BERGAKADEMIE FREIBERG (DE) 2011-04-28 WO disclosed