SCHEMBL1669394

SCHEMBL1669394

C=CC1CCC2=C(C1)O2

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7990371 0.67
SCHEMBL20049585 0.65
SCHEMBL18922082 0.65
SCHEMBL7980897 0.65 ALDH1A1 (0.31)
SCHEMBL2068452 0.65
SCHEMBL9732414 0.64
SCHEMBL2689747 0.63 ALDH1A1 (0.30)
SCHEMBL3468436 0.63 MAPT (0.32)
SCHEMBL6364955 0.63 ALDH1A1 (0.30)
SCHEMBL1045178 0.63 ALDH1A1 (0.30)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 113 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12619144-B2 Positive photosensitive resin composition DONGJIN SEMICHEM CO., LTD. (KR) 2026-05-05 US claimed
CN-116640492-A High-pressure solvent-free impregnating varnish with high storage stability and preparation method and application thereof 上海电气集团上海电机厂有限公司 2023-08-25 CN claimed
US-20220334478-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION DONGJIN SEMICHEM CO., LTD. (KR) 2022-10-20 US claimed
CN-111253425-B Synthesis method of 1, 3-bis [2- (3, 4-epoxycyclohexyl) ethyl ] tetramethyldisiloxane 常州南京大学高新技术研究院 2022-04-29 CN claimed
CN-111269254-B Microwave synthesis method of 1, 3-bis [2- (3, 4-epoxycyclohexyl) ethyl ] tetramethyldisiloxane 常州南京大学高新技术研究院 2022-04-08 CN claimed
WO-2021137599-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION 주식회사 동진쎄미켐 2021-07-08 WO claimed
CN-111269254-A Microwave synthesis method of 1, 3-bis [2- (3, 4-epoxycyclohexyl) ethyl ] tetramethyldisiloxane 常州南京大学高新技术研究院 2020-06-12 CN claimed
CN-111253425-A Synthesis method of 1, 3-bis [2- (3, 4-epoxycyclohexyl) ethyl ] tetramethyldisiloxane 常州南京大学高新技术研究院 2020-06-09 CN claimed
EP-1358193-B1 PROCESS FOR PURIFICATION OF PHOSPHATE ESTERS AKZO NOBEL NV (NL) 2009-12-09 EP claimed
EP-0571114-A1 Polish containing silylated derivatives of organic amines and epoxides DOW CORNING CORPORATION (US) 1993-11-24 EP claimed
EP-0570173-A2 Coating composition containing silylated derivatives of organic amines and epoxides DOW CORNING CORPORATION (US) 1993-11-18 EP claimed
US-5258063-A Polish containing silylated derivatives of organic amines and epoxides DOW CORNING CORPORATION (US) 1993-11-02 US claimed
EP-4743505-A2 NOVEL PHOTOSENSITIVE CARBON DIOXIDE BASED POLYCARBONATE DERIVATIVES AND METHOD FOR PREPARATION OF PHOTO-ANTIMICROBIAL POLYCARBONATE-BIOPLASTICIZER COMPOSITES AND THEIR USE Universidade de Coimbra (PT) 2026-05-20 EP disclosed
US-12619144-B2 Positive photosensitive resin composition DONGJIN SEMICHEM CO., LTD. (KR) 2026-05-05 US disclosed
US-20260005023-A1 METHODS FOR FABRICATING SEMICONDUCTOR DEVICES AND RESIST COMPOSITIONS FOR UNDERLAYERS USED THEREFOR SAMSUNG ELECTRONICS CO LTD (KR) 2026-01-01 US disclosed
US-20250110407-A1 SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD, AND RESIST BASE FILM FORMING COMPOSITION JSR CORPORATION (JP) 2025-04-03 US disclosed
EP-0571114-A1 Polish containing silylated derivatives of organic amines and epoxides DOW CORNING CORPORATION (US) 1993-11-24 EP disclosed
EP-0570173-A2 Coating composition containing silylated derivatives of organic amines and epoxides DOW CORNING CORPORATION (US) 1993-11-18 EP disclosed
US-5258063-A Polish containing silylated derivatives of organic amines and epoxides DOW CORNING CORPORATION (US) 1993-11-02 US disclosed
EP-0432093-A1 Highly reactive printing inks SICPA HOLDING S.A. (CH) 1991-06-12 EP disclosed