⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8072158 | 0.72 | — | — | |
| SCHEMBL308400 | 0.71 | LPO (0.55) | — | |
| SCHEMBL15149 | 0.69 | — | — | |
| SCHEMBL31153305 | 0.69 | LPO (0.52) | — | |
| SCHEMBL16694847 | 0.69 | — | — | |
| Hydrochloric Acid SCHEMBL1806963 | 0.69 | LPO (0.52) | — | |
| SCHEMBL3810295 | 0.67 | — | — | |
| Methimazole SCHEMBL11110599 | 0.67 | — | — | |
| Bromide SCHEMBL8202839 | 0.67 | — | — | |
| SCHEMBL651400 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118666874-A | Bis (imidazolyl) dihydroborane imidazole metal complex and preparation method thereof | 南京工业大学 | 2024-09-20 | — | — | CN | disclosed |
| CN-104471108-B | Copper coating forming agent and method for forming copper coating | 四国化成工业株式会社 | 2020-05-05 | — | — | CN | disclosed |
| US-10405422-B2 | Copper film-forming agent and method for forming copper film | SHIKOKU CHEMICALS CORPORATION (JP) | 2019-09-03 | — | — | US | disclosed |
| US-20150189748-A1 | COPPER FILM-FORMING AGENT AND METHOD FOR FORMING COPPER FILM | SHIKOKU CHEMICALS CORPORATION (JP) | 2015-07-02 | — | — | US | disclosed |
| EP-2871260-A1 | COPPER FILM-FORMING AGENT AND METHOD FOR FORMING COPPER FILM | Shikoku Chemicals Corporation (JP) | 2015-05-13 | — | — | EP | disclosed |
| CN-104471108-A | Copper film-forming agent and method for forming copper film | SHIKOKU CHEM | 2015-03-25 | — | — | CN | disclosed |