SCHEMBL16712191

SCHEMBL16712191

O=S(=O)(OC1CCCCC1OS(=O)(=O)c1cccc2ccccc12)c1cccc2ccccc12

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA1 P00915 1/20 0.47
CA2 P00918 1/20 0.47
CA9 Q16790 1/20 0.47
HTR6 P50406 3/20 0.47
MEN1 O00255 1/20 0.46
KMT2A Q03164 1/20 0.46
NPY5R Q15761 1/20 0.46
CNR1 P21554 6/20 0.44
HTR2A P28223 1/20 0.43
HTR2C P28335 1/20 0.43
EPHX2 P34913 1/20 0.41
PGR P06401 1/20 0.41
F2 P00734 1/20 0.41
PRSS1 P07477 1/20 0.41
PRSS2 P07478 1/20 0.41
PRSS3 P35030 1/20 0.41
HTR7 P34969 3/20 0.39
HTR1D P28221 2/20 0.39
HTR2B P41595 2/20 0.39
HTR1A P08908 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19469342 0.90 HTR6 (0.46) CA1CA2CA9HTR6MEN1
SCHEMBL19469377 0.87 MEN1 (0.46) CA1CA2CA9HTR6MEN1
SCHEMBL8397518 0.87 CA1 (0.47) CA1CA2CA9HTR6MEN1
SCHEMBL1705753 0.86 MEN1 (0.49) CA1CA2CA9HTR6MEN1
SCHEMBL19469356 0.81 CA1 (0.45) CA1CA2CA9HTR6MEN1
SCHEMBL31286100 0.75 CA1 (0.61) CA1CA2CA9HTR6MEN1
SCHEMBL2323729 0.75 CA1 (0.61) CA1CA2CA9HTR6MEN1
SCHEMBL19469345 0.75 HTR6 (0.43) CA1CA2CA9HTR6MEN1
SCHEMBL3240747 0.73 MEN1 (0.53) CA1CA2CA9HTR6MEN1
SCHEMBL724542 0.73 CA1 (0.59) CA1CA2CA9HTR6MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1847568-B1 THERMOSETTING RESIN COMPOSITION, THERMOSETTING-RESIN MOLDING MATERIAL, AND CURED OBJECT OBTAINED THEREFROM SUMITOMO BAKELITE CO (JP) 2015-05-20 EP claimed
EP-1847568-B1 THERMOSETTING RESIN COMPOSITION, THERMOSETTING-RESIN MOLDING MATERIAL, AND CURED OBJECT OBTAINED THEREFROM SUMITOMO BAKELITE CO (JP) 2015-05-20 EP disclosed