Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 11/20 | 0.53 |
| ▸ | KDM4E | B2RXH2 | 10/20 | 0.53 |
| ▸ | HPGD | P15428 | 9/20 | 0.53 |
| ▸ | HSD17B10 | Q99714 | 7/20 | 0.53 |
| ▸ | MAPK1 | P28482 | 6/20 | 0.53 |
| ▸ | TDP1 | Q9NUW8 | 5/20 | 0.53 |
| ▸ | KMT2A | Q03164 | 5/20 | 0.53 |
| ▸ | TSHR | P16473 | 4/20 | 0.53 |
| ▸ | ADORA3 | P0DMS8 | 3/20 | 0.53 |
| ▸ | SMN1; SMN2 | Q16637 | 3/20 | 0.53 |
| ▸ | MAPT | P10636 | 3/20 | 0.53 |
| ▸ | ABCC4 | O15439 | 2/20 | 0.53 |
| ▸ | CACNA1F | O60840 | 2/20 | 0.53 |
| ▸ | ABCB11 | O95342 | 2/20 | 0.53 |
| ▸ | LMNA | P02545 | 2/20 | 0.53 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.53 |
| ▸ | ADORA2A | P29274 | 2/20 | 0.53 |
| ▸ | ADORA1 | P30542 | 2/20 | 0.53 |
| ▸ | OPRM1 | P35372 | 2/20 | 0.53 |
| ▸ | SCN1A | P35498 | 2/20 | 0.53 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6833256 | 0.87 | ALDH1A1 (0.54) | ALDH1A1KDM4EHPGDHSD17B10MAPK1 | |
| SCHEMBL8022086 | 0.86 | KDM4E (0.50) | ALDH1A1KDM4EHPGDHSD17B10MAPK1 | |
| SCHEMBL1720223 | 0.83 | KDM4E (0.64) | ALDH1A1KDM4EHPGDHSD17B10MAPK1 | |
| SCHEMBL30186935 | 0.83 | KDM4E (0.64) | ALDH1A1KDM4EHPGDHSD17B10MAPK1 | |
| SCHEMBL11808823 | 0.81 | KDM4E (0.55) | ALDH1A1KDM4EHPGDHSD17B10MAPK1 | |
| SCHEMBL8024415 | 0.81 | ALDH1A1 (0.54) | ALDH1A1KDM4EHPGDHSD17B10MAPK1 | |
| SCHEMBL29446574 | 0.80 | KDM4E (0.60) | ALDH1A1KDM4EHPGDHSD17B10MAPK1 | |
| SCHEMBL1357406 | 0.80 | KDM4E (0.60) | ALDH1A1KDM4EHPGDHSD17B10MAPK1 | |
| SCHEMBL1673056 | 0.79 | ALDH1A1 (0.52) | ALDH1A1KDM4EHPGDHSD17B10MAPK1 | |
| SCHEMBL1719572 | 0.78 | ALDH1A1 (0.58) | ALDH1A1KDM4EHPGDHSD17B10MAPK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20110084787-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METAL-BASE-CONTAINING CIRCUIT BOARD PRODUCTION METHOD EMPLOYING THE PHOTOSENSITIVE RESIN COMPOSITION, AND METAL-BASE-CONTAINING CIRCUIT BOARD | NITTO DENKO CORPORATION (JP) | 2011-04-14 | — | — | US | claimed |
| US-6132930-A | Negative photoresist composition | NITTO DENKO CORPORATION (JP) | 2000-10-17 | — | — | US | claimed |
| EP-0990949-A1 | Negative photoresist composition | NITTO DENKO CORPORATION (JP) | 2000-04-05 | — | — | EP | claimed |
| US-20110084787-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METAL-BASE-CONTAINING CIRCUIT BOARD PRODUCTION METHOD EMPLOYING THE PHOTOSENSITIVE RESIN COMPOSITION, AND METAL-BASE-CONTAINING CIRCUIT BOARD | NITTO DENKO CORPORATION (JP) | 2011-04-14 | — | — | US | disclosed |
| EP-1577708-B1 | Photosensitive resin composition and use of the same | NITTO DENKO CORP (JP) | 2010-04-14 | — | — | EP | disclosed |
| US-7371506-B2 | Positive photosensitive resin composition | NITTO DENKO CORPORATION (JP) | 2008-05-13 | — | — | US | disclosed |
| EP-1701210-A1 | Positive photosensitive resin composition | Nitto Denko Corporation (JP) | 2006-09-13 | — | — | EP | disclosed |
| US-20060199102-A1 | Positive photosensitive resin composition | NITTO DENKO CORPORATION | 2006-09-07 | — | — | US | disclosed |
| US-7008752-B2 | Photosensitive resin composition and use of the same | NITTO DENKO CORPORATION (JP) | 2006-03-07 | — | — | US | disclosed |
| US-20050208421-A1 | Photosensitive resin composition and use of the same | NITTO DENKO CORPORATION | 2005-09-22 | — | — | US | disclosed |
| EP-1577708-A2 | Photosensitive resin composition and use of the same | NITTO DENKO CORPORATION (JP) | 2005-09-21 | — | — | EP | disclosed |
| US-20050004288-A1 | Resin composition, composition for solder resist, and cured article obtained therefrom | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2005-01-06 | — | — | US | disclosed |
| EP-1416003-A1 | RESIN COMPOSITION, COMPOSITION FOR SOLDER RESIST, AND CURED ARTICLE OBTAINED THEREFROM | Nippon Kayaku Kabushiki Kaisha (JP) | 2004-05-06 | — | — | EP | disclosed |
| US-6300037-B1 | POLYIMIDE PRECURSOR FORMS PATTERNED FILM BY EXPOSURE TO LIGHT THROUGH PHOTOMASK; DEVELOPMENT; FILM MELTS UPON HEATING; BONDING STRENGTH | NITTO DENKO CORPORATION (JP) | 2001-10-09 | — | — | US | disclosed |
| US-6132930-A | Negative photoresist composition | NITTO DENKO CORPORATION (JP) | 2000-10-17 | — | — | US | disclosed |
| EP-0990949-A1 | Negative photoresist composition | NITTO DENKO CORPORATION (JP) | 2000-04-05 | — | — | EP | disclosed |