SCHEMBL16788916

SCHEMBL16788916

C=C[Si](C)(C)O[Si](C)(C)O[Si](C)(O[Si](C)(C=C)O[Si](C)(C)C=C)c1ccccc1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17704576 0.94
SCHEMBL17717347 0.94
SCHEMBL10015519 0.92
SCHEMBL2600704 0.92
SCHEMBL13305221 0.86 ESR1 (0.30)
SCHEMBL16788918 0.85
SCHEMBL9007134 0.85
SCHEMBL296516 0.84 ESR1 (0.33)
SCHEMBL25702258 0.84
SCHEMBL12268484 0.83 ESR1 (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230303840-A1 THIXOTROPIC POLYSILOXANE PASTES FOR ADDITIVE MANUFACTURING HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC 2023-09-28 US disclosed
US-11680167-B2 Thixotropic polysiloxane pastes for additive manufacturing HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC (US) 2023-06-20 US disclosed
US-9464191-B2 Silicon-containing curing composition and cured product thereof ADEKA CORPORATION (JP) 2016-10-11 US disclosed
US-20150158982-A1 SILICON-CONTAINING CURING COMPOSITION AND CURED PRODUCT THEREOF ADEKA CORPORATION (JP) 2015-06-11 US disclosed