SCHEMBL168226

SCHEMBL168226

CC(C#CO)c1ccccc1

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ADRA2C P18825 2/20 0.41
KDM4E B2RXH2 2/20 0.41
LMNA P02545 2/20 0.41
ADRA2A P08913 1/20 0.41
HIF1A Q16665 1/20 0.41
ALDH1A1 P00352 2/20 0.40
CACNA2D1 P54289 1/20 0.39
CACNB2 Q08289 1/20 0.39
CACNA1C Q13936 1/20 0.39
MIF P14174 2/20 0.39
TSHR P16473 2/20 0.39
CHRM2 P08172 1/20 0.39
ADRA1A P35348 1/20 0.39
RGS12 O14924 1/20 0.39
GLA P06280 1/20 0.39
CYP3A4 P08684 1/20 0.39
CYP2D6 P10635 1/20 0.39
CYP2C9 P11712 1/20 0.39
PKM P14618 1/20 0.39
ALOX15 P16050 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9303811 0.85 MIF (0.44) ADRA2CKDM4ELMNAADRA2AHIF1A
SCHEMBL26210808 0.78 MIF (0.40) ADRA2CKDM4ELMNAADRA2AHIF1A
SCHEMBL6014617 0.78 TAAR1 (0.44) ADRA2CKDM4ELMNAADRA2AHIF1A
SCHEMBL1453760 0.76 MIF (0.39) ADRA2CKDM4ELMNAADRA2AHIF1A
SCHEMBL6024979 0.76 TAAR1 (0.40) ADRA2CKDM4ELMNAADRA2AHIF1A
SCHEMBL1110900 0.75 TSHR (0.41) LMNATSHRCYP2D6SRCTRPA1
SCHEMBL30172156 0.74 APP (0.48) LMNAMIFCYP3A4CYP2C9HTR2A
SCHEMBL2867417 0.74 MIF (0.44) ADRA2CKDM4ELMNAADRA2AHIF1A
SCHEMBL9619367 0.73 TSHR (0.56) ADRA2CKDM4ELMNAADRA2AHIF1A
SCHEMBL18245376 0.73 MIF (0.36) ADRA2CKDM4ELMNAADRA2AHIF1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1527 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4743507-A1 THERMALLY CONDUCTIVE COMPOSITION Dow Silicones Corporation (US) 2026-05-20 EP claimed
CN-119912818-A Low-thermal-resistance heat-conducting gel and preparation method thereof 深圳市汉华热管理科技有限公司 2025-05-02 CN claimed
CN-119592076-A Surface flexible heat-conducting silicon rubber composite material and preparation method thereof 江苏大学 2025-03-11 CN claimed
CN-119463502-A Longitudinal conductive film and preparation method and application thereof 深圳市飞荣达科技股份有限公司 2025-02-18 CN claimed
CN-119391363-A Heat-conducting wave-absorbing pouring sealant for power transformer, preparation and use methods 中国电子科技集团公司第三十三研究所 2025-02-07 CN claimed
WO-2025014698-A1 THERMALLY CONDUCTIVE COMPOSITION DOW SILICONES CORPORATION (US) 2025-01-16 WO claimed
CN-119264870-A Organic silicon gel for high-power IGBT packaging for preventing hydrogen sulfide gas erosion and preparation method and application thereof 成都拓利科技股份有限公司 2025-01-07 CN claimed
WO-2024239423-A1 LOW-VOLATILITY, HIGH-THERMAL-CONDUCTIVITY AND SINGLE-COMPONENT ADDITION-TYPE THERMAL CONDUCTIVE CEMENT AND PREPARATION METHOD THEREFOR 江西天永诚高分子材料有限公司 2024-11-28 WO claimed
CN-118991385-A Heat-insulating car clothing device and preparation process thereof 南通纳尔材料科技有限公司 2024-11-22 CN claimed
CN-118772697-A Silica gel for digital printing and preparation method and application thereof 东莞市云轩新材料科技有限公司 2024-10-15 CN claimed
EP-0995747-A1 Substituted sulfonylphenylheterocycles as cyclooxygenase-2 and 5-lipoxygenase inhibitors G.D. SEARLE & CO. (US) 2000-04-26 EP claimed
EP-0828736-A1 SUBSTITUTED SULFONYLPHENYLHETEROCYCLES AS CYCLOOXYGENASE-2 AND 5-LIPOXYGENASE INHIBITORS G.D. SEARLE & CO. (US) 1998-03-18 EP claimed
WO-1996038442-A1 SUBSTITUTED SULFONYLPHENYLHETEROCYCLES AS CYCLOOXYGENASE-2 AND 5-LIPOXYGENASE INHIBITORS G.D. SEARLE & CO. (US) 1996-12-05 WO claimed
US-5578381-A FLUORINATED POLYSILOXANE, POLYHYDROGENSILOXANE OR VINYLSILOXANE, PLATINUM CATALYST DOW CORNING TORAY SILICONE CO., LTD. (JP) 1996-11-26 US claimed
US-5545831-A DOES NOT IMPAIR RESIDUAL ADHESION OF TACKY SUBSTANCES DOW CORNING TORAY SILICONE CO., LTD. (JP) 1996-08-13 US claimed
EP-0699725-A1 Release agent compositions Dow Corning Toray Silicone Co., Ltd. (JP) 1996-03-06 EP claimed
US-5370936-A Low temperature curing DOW CORNING TORAY SILICONE CO., LTD. (JP) 1994-12-06 US claimed
EP-0192130-B1 CORROSION INHIBITOR COMPOSITION HENKEL CORPORATION (a Delaware corp.) (US) 1990-06-27 EP claimed
EP-0192130-A2 Corrosion inhibitor composition HENKEL CORPORATION (a Delaware corp.) (US) 1986-08-27 EP claimed
US-4603168-A Method for curing organopolysiloxane compositions and the compositions TORAY SILICONE CO., LTD. (JP) 1986-07-29 US claimed