SCHEMBL168228

SCHEMBL168228

OCC#CCc1ccccc1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.48
TDP1 Q9NUW8 1/20 0.44
FFAR1 O14842 1/20 0.43
FFAR4 Q5NUL3 1/20 0.43
KCNH2 Q12809 2/20 0.42
KDM4E B2RXH2 1/20 0.42
LMNA P02545 1/20 0.42
POLB P06746 1/20 0.41
L3MBTL1 Q9Y468 1/20 0.41
CALM1 P0DP23 1/20 0.39
SMN1; SMN2 Q16637 1/20 0.38
IDO1 P14902 2/20 0.37
THRB P10828 1/20 0.37
CES2 O00748 1/20 0.37
CES1 P23141 1/20 0.37
AKR1B1 P15121 1/20 0.37
HPGD P15428 1/20 0.37
SRR Q9GZT4 1/20 0.36
TP53 P04637 1/20 0.36
LOXL2 Q9Y4K0 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3888886 0.87 CALM1 (0.50) TSHRTDP1FFAR1FFAR4KCNH2
SCHEMBL6722156 0.81 TDP1 (0.46) TSHRTDP1FFAR1FFAR4KCNH2
SCHEMBL6722509 0.78 KDM4E (0.44) TSHRTDP1FFAR1FFAR4KCNH2
SCHEMBL10871647 0.78 TSHR (0.50) TSHRTDP1FFAR1FFAR4KDM4E
SCHEMBL3633156 0.77 FFAR1 (0.44) TSHRTDP1FFAR1FFAR4KCNH2
SCHEMBL6443916 0.76
SCHEMBL10799608 0.76 KCNH2 (0.45) KCNH2LMNAIDO1
SCHEMBL367520 0.76 TDP1 (0.52) TSHRTDP1FFAR1FFAR4KCNH2
SCHEMBL7461859 0.76 FFAR1 (0.53) TSHRTDP1FFAR1FFAR4KDM4E
SCHEMBL9856631 0.76 CALM1 (0.45) TSHRFFAR1FFAR4KCNH2CALM1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1537 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4743507-A1 THERMALLY CONDUCTIVE COMPOSITION Dow Silicones Corporation (US) 2026-05-20 EP claimed
CN-119912818-A Low-thermal-resistance heat-conducting gel and preparation method thereof 深圳市汉华热管理科技有限公司 2025-05-02 CN claimed
CN-119592076-A Surface flexible heat-conducting silicon rubber composite material and preparation method thereof 江苏大学 2025-03-11 CN claimed
CN-119391363-A Heat-conducting wave-absorbing pouring sealant for power transformer, preparation and use methods 中国电子科技集团公司第三十三研究所 2025-02-07 CN claimed
WO-2025014698-A1 THERMALLY CONDUCTIVE COMPOSITION DOW SILICONES CORPORATION (US) 2025-01-16 WO claimed
CN-119264870-A Organic silicon gel for high-power IGBT packaging for preventing hydrogen sulfide gas erosion and preparation method and application thereof 成都拓利科技股份有限公司 2025-01-07 CN claimed
WO-2024239423-A1 LOW-VOLATILITY, HIGH-THERMAL-CONDUCTIVITY AND SINGLE-COMPONENT ADDITION-TYPE THERMAL CONDUCTIVE CEMENT AND PREPARATION METHOD THEREFOR 江西天永诚高分子材料有限公司 2024-11-28 WO claimed
CN-118991385-A Heat-insulating car clothing device and preparation process thereof 南通纳尔材料科技有限公司 2024-11-22 CN claimed
CN-118772697-A Silica gel for digital printing and preparation method and application thereof 东莞市云轩新材料科技有限公司 2024-10-15 CN claimed
CN-118755269-A Waterproof organic silicon leather composite material and preparation method thereof 匠指(广东)有机硅材料有限公司 2024-10-11 CN claimed
CN-101616996-B Addition reaction curable silicone rubber composition and molded article made therefrom DOW CORNING TORAY CO LTD 2012-05-23 CN claimed
US-6759467-B2 CURABLE; USING HYDROSILATION CATALYST SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-07-06 US claimed
EP-0908462-B1 Silatrane derivative and curable silicone composition containing same DOW CORNING TORAY SILICONE (JP) 2003-07-16 EP claimed
US-5578381-A FLUORINATED POLYSILOXANE, POLYHYDROGENSILOXANE OR VINYLSILOXANE, PLATINUM CATALYST DOW CORNING TORAY SILICONE CO., LTD. (JP) 1996-11-26 US claimed
US-5545831-A DOES NOT IMPAIR RESIDUAL ADHESION OF TACKY SUBSTANCES DOW CORNING TORAY SILICONE CO., LTD. (JP) 1996-08-13 US claimed
EP-0699725-A1 Release agent compositions Dow Corning Toray Silicone Co., Ltd. (JP) 1996-03-06 EP claimed
US-5370936-A Low temperature curing DOW CORNING TORAY SILICONE CO., LTD. (JP) 1994-12-06 US claimed
EP-0192130-B1 CORROSION INHIBITOR COMPOSITION HENKEL CORPORATION (a Delaware corp.) (US) 1990-06-27 EP claimed
EP-0192130-A2 Corrosion inhibitor composition HENKEL CORPORATION (a Delaware corp.) (US) 1986-08-27 EP claimed
US-4603168-A Method for curing organopolysiloxane compositions and the compositions TORAY SILICONE CO., LTD. (JP) 1986-07-29 US claimed