Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA4 | P22748 | 2/20 | 0.42 |
| ▸ | CTSL | P07711 | 1/20 | 0.39 |
| ▸ | CA2 | P00918 | 1/20 | 0.37 |
| ▸ | SLC22A16 | Q86VW1 | 1/20 | 0.32 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.31 |
| ▸ | TSHR | P16473 | 2/20 | 0.31 |
| ▸ | NFKB1 | P19838 | 2/20 | 0.31 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.31 |
| ▸ | CPT2 | P23786 | 1/20 | 0.30 |
| ▸ | CPT1A | P50416 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL18492612 | 0.95 | CA4 (0.42) | CA4CTSLCA2SLC22A16CYP3A4 | |
| Silver SCHEMBL1860802 | 0.95 | CA4 (0.42) | CA4CTSLCA2SLC22A16CYP3A4 | |
| SCHEMBL187912 | 0.95 | CA4 (0.46) | CA4CTSLCA2SLC22A16CYP3A4 | |
| SCHEMBL2494695 | 0.95 | CA4 (0.42) | CA4CTSLCA2SLC22A16CYP3A4 | |
| SCHEMBL1860808 | 0.95 | CA4 (0.42) | CA4CTSLCA2SLC22A16CYP3A4 | |
| Potassium Ion SCHEMBL6055454 | 0.95 | CA4 (0.42) | CA4CTSLCA2SLC22A16CYP3A4 | |
| SCHEMBL5931239 | 0.95 | CA4 (0.42) | CA4CTSLCA2SLC22A16CYP3A4 | |
| Zinc Ion SCHEMBL5931298 | 0.95 | CA4 (0.42) | CA4CTSLCA2SLC22A16CYP3A4 | |
| SCHEMBL21962881 | 0.95 | CA4 (0.42) | CA4CTSLCA2SLC22A16CYP3A4 | |
| SCHEMBL8993205 | 0.95 | CA4 (0.42) | CA4CTSLCA2SLC22A16CYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111641016-A | Preparation method of surface electrode of ceramic filter | 深圳第三代半导体研究院 | 2020-09-08 | — | — | CN | claimed |
| US-11993862-B2 | Structure including copper plating layer or copper alloy plating layer | ISHIHARA CHEMICAL CO., LTD. (JP) | 2024-05-28 | — | — | US | disclosed |
| US-11946153-B2 | Copper or copper alloy electroplating bath | ISHIHARA CHEMICAL CO., LTD. (JP) | 2024-04-02 | — | — | US | disclosed |
| US-11939691-B2 | Tin or tin alloy electroplating bath, and electronic component having electrodeposit formed thereon using the plating bath | ISHIHARA CHEMICAL CO., LTD. (JP) | 2024-03-26 | — | — | US | disclosed |
| US-20220316085-A1 | STRUCTURE INCLUDING COPPER PLATING LAYER OR COPPER ALLOY PLATING LAYER | ISHIHARA CHEMICAL CO., LTD. (JP) | 2022-10-06 | — | — | US | disclosed |
| US-20220127741-A1 | COPPER OR COPPER ALLOY ELECTROPLATING BATH | ISHIHARA CHEMICAL CO., LTD. (JP) | 2022-04-28 | — | — | US | disclosed |
| US-10879116-B2 | Method for copper plating through silicon vias using wet wafer back contact | APPLIED MATERIALS, INC. (US) | 2020-12-29 | — | — | US | disclosed |
| CN-111641016-A | Preparation method of surface electrode of ceramic filter | 深圳第三代半导体研究院 | 2020-09-08 | — | — | CN | disclosed |
| EP-2660826-B1 | WHITE CONDUCTIVE POWDER, CONDUCTIVE MIXED POWDER, DISPERSION LIQUID, COATING MATERIAL, AND MEMBRANE COMPOSITION | MITSUBISHI MAT ELECTRONIC CHEMICALS CO LTD (JP) | 2018-07-04 | — | — | EP | disclosed |
| US-9935004-B2 | Process and chemistry of plating of through silicon vias | APPLIED MATERIALS, INC. (US) | 2018-04-03 | — | — | US | disclosed |
| US-20100126849-A1 | APPARATUS AND METHOD FOR FORMING 3D NANOSTRUCTURE ELECTRODE FOR ELECTROCHEMICAL BATTERY AND CAPACITOR | APPLIED MATERIALS, INC. (US) | 2010-05-27 | — | — | US | disclosed |
| US-6607653-B1 | Tin-copper alloy plating bath, tin-copper-bismuth alloy plating bath or tin-copper-silver alloy plating bath containing a soluble metal compound and a specific sulfur-containing compound. The plating bath of the alloy with | DAIWA FINE CHEMICALS CO., LTD. (JP) | 2003-08-19 | — | — | US | disclosed |
| US-6544398-B2 | For forming gold-tin alloy plating film; brightness; electronics | ISHIHARA CHEMICAL CO., LTD (JP) | 2003-04-08 | — | — | US | disclosed |
| US-20020063063-A1 | Non-cyanide-type gold-tin alloy plating bath | ISHIHARA CHEMICAL CO., LTD. (JP) | 2002-05-30 | — | — | US | disclosed |
| EP-0501480-B1 | Analysis of tin, lead or tin-lead alloy plating solution | UYEMURA C & CO LTD (JP) | 1997-05-28 | — | — | EP | disclosed |
| EP-0503389-B1 | Process for electroless plating tin, lead or tin-lead alloy | UYEMURA C & CO LTD (JP) | 1997-05-14 | — | — | EP | disclosed |
| US-5294554-A | Adding an oxidizing agent to decompose the copper/thiourea complex and oxidize the copper | C. UYEMURA & CO., LTD. (JP) | 1994-03-15 | — | — | US | disclosed |
| US-5248527-A | On copper, measuring concentration of copper ions | C. UYEMURA AND COMPANY, LIMITED (JP) | 1993-09-28 | — | — | US | disclosed |
| EP-0503389-A2 | Process for electroless plating tin, lead or tin-lead alloy | C. UYEMURA & CO, LTD (JP) | 1992-09-16 | — | — | EP | disclosed |
| EP-0501480-A2 | Analysis of tin, lead or tin-lead alloy plating solution | C. UYEMURA & CO, LTD (JP) | 1992-09-02 | — | — | EP | disclosed |