Silver

Silver

SCHEMBL1860802

O=C([O-])CC(C(=O)[O-])S(=O)(=O)O.[Ag+].[Ag+]

nearest known ligand 0.42

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Known targets — ChEMBL curated mechanism

folP

The experimentally established mechanism targets of Silver. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
CA4 P22748 2/20 0.42
CTSL P07711 1/20 0.39
CA2 P00918 1/20 0.37
SLC22A16 Q86VW1 1/20 0.32
CYP3A4 P08684 2/20 0.31
TSHR P16473 2/20 0.31
NFKB1 P19838 2/20 0.31
NPSR1 Q6W5P4 2/20 0.31
CPT2 P23786 1/20 0.30
CPT1A P50416 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18492612 0.95 CA4 (0.42) CA4CTSLCA2SLC22A16CYP3A4
Zinc Ion SCHEMBL5931298 0.95 CA4 (0.42) CA4CTSLCA2SLC22A16CYP3A4
SCHEMBL187912 0.95 CA4 (0.46) CA4CTSLCA2SLC22A16CYP3A4
SCHEMBL2494695 0.95 CA4 (0.42) CA4CTSLCA2SLC22A16CYP3A4
SCHEMBL1860808 0.95 CA4 (0.42) CA4CTSLCA2SLC22A16CYP3A4
Potassium Ion SCHEMBL6055454 0.95 CA4 (0.42) CA4CTSLCA2SLC22A16CYP3A4
SCHEMBL1682880 0.95 CA4 (0.42) CA4CTSLCA2SLC22A16CYP3A4
SCHEMBL5931239 0.95 CA4 (0.42) CA4CTSLCA2SLC22A16CYP3A4
SCHEMBL21962881 0.95 CA4 (0.42) CA4CTSLCA2SLC22A16CYP3A4
SCHEMBL8993205 0.95 CA4 (0.42) CA4CTSLCA2SLC22A16CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117071015-A Forward and reverse pulse electrolytic silver alloy solution, preparation method, electroplating method and silver alloy coating 安徽智备工业科技有限公司 2023-11-17 CN claimed
CN-111657347-A Fruit and vegetable antibacterial material capable of actively removing ethylene and preparation process thereof 福建省凡通科技发展有限公司 2020-09-15 CN claimed
US-20040013984-A1 Black-and-white organic solvent-based photothermographic materials containing mercaptotriazole toners EASTMAN KODAK COMPANY 2004-01-22 US claimed
EP-1380888-A1 Black-and-white photothermographic materials containing mercaptotriazole toners EASTMAN KODAK COMPANY (US) 2004-01-14 EP claimed
CN-117737716-A Plating method for silver sintering connection, plating film, substrate for power module, semiconductor element, and semiconductor device 上村工业株式会社 2024-03-22 CN disclosed
CN-117071015-A Forward and reverse pulse electrolytic silver alloy solution, preparation method, electroplating method and silver alloy coating 安徽智备工业科技有限公司 2023-11-17 CN disclosed
CN-113345624-B Insulating coated conductive particles, anisotropic conductive adhesive, and connection structure 株式会社力森诺科 2023-05-12 CN disclosed
CN-113345624-A Insulating coated conductive particle, anisotropic conductive adhesive, and connection structure 昭和电工材料株式会社 2021-09-03 CN disclosed
CN-111657347-A Fruit and vegetable antibacterial material capable of actively removing ethylene and preparation process thereof 福建省凡通科技发展有限公司 2020-09-15 CN disclosed
CN-108701508-B Conductive particle, insulation-coated conductive particle, anisotropic conductive adhesive, connection structure, and method for producing conductive particle 日立化成株式会社 2020-03-24 CN disclosed
CN-108604480-B Conductive particle, insulation-coated conductive particle, anisotropic conductive adhesive, connection structure, and method for producing conductive particle 日立化成株式会社 2020-03-24 CN disclosed
EP-1591563-B1 TIN-CONTAINING PLATING BATH ISHIHARA CHEMICAL CO LTD (JP) 2018-04-04 EP disclosed
US-7510694-B2 Process for simultaneous preparation of nanocrystalline anatase titanium dioxide powder and hydrazine monohydrochloride COUNCIL OF SCIENTIFIC & INDUSTRIAL RESEARCH (IN) 2009-03-31 US disclosed
EP-1685068-B1 PROCESS FOR SIMULTANEOUS PREPARATION OF NANOCRYSTALLINE TITANIUM DIOXIDE AND HYDRAZINE MONOHYDROCHLORIDE COUNCIL SCIENT IND RES (IN) 2009-03-18 EP disclosed
EP-1685068-A1 PROCESS FOR SIMULTANEOUS PREPARATION OF NANOCRYSTALLINE TITANIUM DIOXIDE AND HYDRAZINE MONOHYDROCHLORIDE COUNCIL OF SCIENTIFIC AND INDUSTRIAL RESEARCH (IN) 2006-08-02 EP disclosed
US-20060113006-A1 Tin-containing plating bath ISHIHARA CHEMICAL CO., LTD. (JP) 2006-06-01 US disclosed
EP-1591563-A1 TIN-CONTAINING PLATING BATH Ishihara Chemical Co., Ltd. (JP) 2005-11-02 EP disclosed
WO-2005051847-A1 PROCESS FOR SIMULTANEOUS PREPARATION OF NANOCRYSTALLINE TITANIUM DIOXIDE AND HYDRAZINE MONOHYDROCHLORIDE COUNCIL OF SCIENTIFIC AND INDUSTRIAL RESEARCH (IN) 2005-06-09 WO disclosed
US-20050106095-A1 Process for simultaneous preparation of nanocystalline anatase titanium dioxide powder and hydrazine monohydrochloride COUNCIL OF SCIENTIFIC AND INDUSTRIAL RESEARCH (IN) 2005-05-19 US disclosed
US-6607653-B1 Tin-copper alloy plating bath, tin-copper-bismuth alloy plating bath or tin-copper-silver alloy plating bath containing a soluble metal compound and a specific sulfur-containing compound. The plating bath of the alloy with DAIWA FINE CHEMICALS CO., LTD. (JP) 2003-08-19 US disclosed