Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | BRS3 | P32247 | 2/20 | 0.43 |
| ▸ | HRH3 | Q9Y5N1 | 1/20 | 0.42 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.38 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.38 |
| ▸ | MEN1 | O00255 | 1/20 | 0.38 |
| ▸ | POLB | P06746 | 1/20 | 0.38 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.38 |
| ▸ | PARP1 | P09874 | 1/20 | 0.37 |
| ▸ | TP53 | P04637 | 1/20 | 0.36 |
| ▸ | MDM2 | Q00987 | 1/20 | 0.36 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.36 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.36 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.36 |
| ▸ | PI4KA | P42356 | 1/20 | 0.36 |
| ▸ | PI4K2B | Q8TCG2 | 1/20 | 0.36 |
| ▸ | PI4K2A | Q9BTU6 | 1/20 | 0.36 |
| ▸ | PI4KB | Q9UBF8 | 1/20 | 0.36 |
| ▸ | GABRP | O00591 | 1/20 | 0.36 |
| ▸ | GABRD | O14764 | 1/20 | 0.36 |
| ▸ | GABRA1 | P14867 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27458278 | 0.92 | GPR84 (0.42) | ALDH1A1PI4KAPI4K2BPI4K2API4KB | |
| SCHEMBL7484552 | 0.87 | GLA (0.39) | BRS3 | |
| SCHEMBL810902 | 0.84 | BRS3 (0.47) | BRS3HRH3ALDH1A1MAPK1MEN1 | |
| SCHEMBL28063353 | 0.82 | GPR84 (0.49) | BRS3 | |
| SCHEMBL6251513 | 0.79 | HRH3 (0.38) | BRS3HRH3ALDH1A1MAPK1MEN1 | |
| SCHEMBL652534 | 0.79 | PI4KA (0.43) | PI4KAPI4K2BPI4K2API4KB | |
| SCHEMBL14037799 | 0.78 | — | — | |
| SCHEMBL7767311 | 0.78 | HRH3 (0.37) | BRS3HRH3ALDH1A1MAPK1MEN1 | |
| SCHEMBL28774002 | 0.78 | BRS3 (0.39) | BRS3HRH3ALDH1A1MAPK1PARP1 | |
| Hydrochloric Acid SCHEMBL8117521 | 0.77 | PI4KA (0.39) | BRS3ALDH1A1PI4KAPI4K2BPI4K2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6703124-B2 | COPPER THIN FILM LAMINATE; NONFLAMMABLE; HEAT RESISTANCE | LG CHEMICAL CO., LTD. (KR) | 2004-03-09 | — | — | US | claimed |
| US-20030054146-A1 | Epoxy resin composition and laminate using the same | LG CHEMICAL CO., LTD. (KR) | 2003-03-20 | — | — | US | claimed |
| WO-2001096440-A1 | EPOXY RESIN COMPOSITION AND LAMINATE USING THE SAME | LG CHEMICAL CO., LTD. (KR) | 2001-12-20 | — | — | WO | claimed |
| US-11535750-B2 | Thermosetting resin composition for semiconductor package and prepreg and metal clad laminate using the same | LG CHEM, LTD. (KR) | 2022-12-27 | — | — | US | disclosed |
| US-11193015-B2 | Thermosetting resin composition for semiconductor package and prepreg using the same | LG CHEM, LTD. (KR) | 2021-12-07 | — | — | US | disclosed |
| US-20200190313-A1 | THERMOSETTING RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE AND PREPREG USING THE SAME | LG CHEM, LTD. (KR) | 2020-06-18 | — | — | US | disclosed |
| WO-2019160287-A1 | THERMOSETTING RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE AND PREPREG USING SAME | 주식회사 엘지화학 | 2019-08-22 | — | — | WO | disclosed |
| US-10294341-B2 | Thermosetting resin composition for semiconductor package and prepreg using the same | LG CHEM, LTD. (KR) | 2019-05-21 | — | — | US | disclosed |
| US-20180148555-A1 | Thermosetting resin composition for semiconductor package and prepreg using the same | LG CHEM, LTD. (KR) | 2018-05-31 | — | — | US | disclosed |
| WO-2017122952-A1 | THERMOSETTING RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE AND PREPREG USING SAME | 주식회사 엘지화학 | 2017-07-20 | — | — | WO | disclosed |
| US-20160369099-A1 | THERMOSETTING RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE AND PREPREG AND METAL CLAD LAMINATE USING THE SAME | LG CHEM, LTD. (KR) | 2016-12-22 | — | — | US | disclosed |
| US-9278505-B2 | Thermosetting resin composition and prepreg and metal clad laminate using the same | LG CHEM, LTD. (KR) | 2016-03-08 | — | — | US | disclosed |
| US-20130319609-A1 | THERMOSETTING RESIN COMPOSITION AND PREPREG AND METAL CLAD LAMINATE USING THE SAME | LG CHEM, LTD. (KR) | 2013-12-05 | — | — | US | disclosed |
| US-20120008252-A1 | DIELECTRIC PASTE HAVING A LOW DIELECTRIC LOSS, METHOD OF MANUFACTURE THEREOF AND AN ARTICLE THAT USES THE SAME | SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) | 2012-01-12 | — | — | US | disclosed |
| US-20100051340-A1 | DIELECTRIC PASTE HAVING A LOW DIELECTRIC LOSS, METHOD OF MANUFACTURE THEREOF AND AN ARTICLE THAT USES THE SAME | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2010-03-04 | — | — | US | disclosed |
| US-6703124-B2 | COPPER THIN FILM LAMINATE; NONFLAMMABLE; HEAT RESISTANCE | LG CHEMICAL CO., LTD. (KR) | 2004-03-09 | — | — | US | disclosed |
| US-20030054146-A1 | Epoxy resin composition and laminate using the same | LG CHEMICAL CO., LTD. (KR) | 2003-03-20 | — | — | US | disclosed |
| WO-2001096440-A1 | EPOXY RESIN COMPOSITION AND LAMINATE USING THE SAME | LG CHEMICAL CO., LTD. (KR) | 2001-12-20 | — | — | WO | disclosed |