Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 1/20 | 0.44 |
| ▸ | CDK1 | P06493 | 1/20 | 0.33 |
| ▸ | CCNB1 | P14635 | 1/20 | 0.33 |
| ▸ | CCNE1 | P24864 | 1/20 | 0.33 |
| ▸ | CDK2 | P24941 | 1/20 | 0.33 |
| ▸ | CYP26A1 | O43174 | 1/20 | 0.32 |
| ▸ | ADORA3 | P0DMS8 | 1/20 | 0.30 |
| ▸ | ADORA2A | P29274 | 1/20 | 0.30 |
| ▸ | ADORA2B | P29275 | 1/20 | 0.30 |
| ▸ | ADORA1 | P30542 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11338052 | 0.81 | TSHR (0.33) | TSHRCDK1CCNB1CCNE1CDK2 | |
| SCHEMBL10946321 | 0.79 | TSHR (0.35) | TSHRCDK1CCNB1CCNE1CDK2 | |
| SCHEMBL28563811 | 0.79 | TSHR (0.44) | TSHR | |
| SCHEMBL136105 | 0.79 | BRD4 (0.43) | ADORA3ADORA2AADORA2BADORA1 | |
| SCHEMBL28563331 | 0.76 | TSHR (0.42) | TSHR | |
| SCHEMBL2156929 | 0.76 | TSHR (0.51) | TSHRCDK1CCNB1CCNE1CDK2 | |
| SCHEMBL28564369 | 0.74 | TSHR (0.40) | TSHR | |
| SCHEMBL28577363 | 0.73 | TSHR (0.40) | TSHR | |
| SCHEMBL10997386 | 0.72 | BRD4 (0.37) | TSHRCYP26A1 | |
| SCHEMBL27284489 | 0.72 | BRD4 (0.37) | TSHRCYP26A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4738433-A1 | LIQUID COMPRESSION MOLDING MATERIAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT | Namics Corporation (JP) | 2026-05-06 | — | — | EP | disclosed |
| WO-2025004453-A1 | LIQUID COMPRESSION MOLDING MATERIAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT | ナミックス株式会社 | 2025-01-02 | — | — | WO | disclosed |
| CN-118176231-A | Curable resin composition | 纳美仕有限公司 | 2024-06-11 | — | — | CN | disclosed |
| WO-2023090317-A1 | CURABLE RESIN COMPOSITION | ナミックス株式会社 | 2023-05-25 | — | — | WO | disclosed |
| CN-115668484-A | Liquid compression molding material | 纳美仕有限公司 | 2023-01-31 | — | — | CN | disclosed |
| EP-2576657-B1 | METHODS FOR PRODUCING CROSSLINKABLE SILYL GROUP-CONTAINING POLYOXYALKYLENE POLYMERS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2017-01-18 | — | — | EP | disclosed |
| US-8916669-B2 | Methods for producing crosslinkable silyl group-containing polyoxyalkylene polymers | DOW GLOBAL TECHNOLOGIES LLC (US) | 2014-12-23 | — | — | US | disclosed |
| EP-2576657-A2 | METHODS FOR PRODUCING CROSSLINKABLE SILYL GROUP-CONTAINING POLYOXYALKYLENE POLYMERS | Dow Global Technologies LLC (US) | 2013-04-10 | — | — | EP | disclosed |
| US-20130060000-A1 | METHODS FOR PRODUCING CROSSLINKABLE SILYL GROUP-CONTAINING POLYOXYALKYLENE POLYMERS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2013-03-07 | — | — | US | disclosed |
| WO-2011150161-A2 | METHODS FOR PRODUCING CROSSLINKABLE SILYL GROUP-CONTAINING POLYOXYALKYLENE POLYMERS. | DOW GLOBAL TECHNOLOGIES LLC (US) | 2011-12-01 | — | — | WO | disclosed |
| EP-0071812-B1 | POWDER LACQUERS | BASF Lacke + Farben AG (DE) | 1985-02-20 | — | — | EP | disclosed |
| EP-0012566-B1 | ELECTRIC WINDINGS AND PRODUCTION THEREOF | Hitachi, Ltd. (JP) | 1983-06-22 | — | — | EP | disclosed |
| EP-0071813-A2 | Synthetic resin | BASF Lacke + Farben AG (DE) | 1983-02-16 | — | — | EP | disclosed |
| EP-0071812-A2 | Powder lacquers | BASF Lacke + Farben AG (DE) | 1983-02-16 | — | — | EP | disclosed |
| US-4269894-A | AS BINDERS FOR THE MULTILAYERED INSULATION; IMPREGNATING WITH A VARNISH OF EPOXY-ISOCYANATE RESIN; WATERPROOFING | HITACHI, LTD. (JP) | 1981-05-26 | — | — | US | disclosed |
| US-4222802-A | SILICONE RESIN INSULATOR, IMPREGNATING WITH VARNISH OF AN EPOXY COMPOUND AND AN ISOCYANATE COMPOUND, CURING | HITACHI, LTD. (JP) | 1980-09-16 | — | — | US | disclosed |
| EP-0012566-A1 | Electric windings and production thereof | Hitachi, Ltd. (JP) | 1980-06-25 | — | — | EP | disclosed |
| US-4130546-A | EPOXY, ISOCYANATE, CURING AGNET, MODIFIED BUTADIENE POLYMER | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1978-12-19 | — | — | US | disclosed |
| US-4129554-A | PICRIC ACID, QUINONE, CHLORANIL, CYANOACETATE ESTER | HITACHI CHEMICAL CO., LTD. (JP) | 1978-12-12 | — | — | US | disclosed |
| US-4128531-A | EPOXY, ISOCYANATE, CURING AGENT, HYDROXYLATED BUTADIENE POLYMER | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1978-12-05 | — | — | US | disclosed |