SCHEMBL2156929

SCHEMBL2156929

Cc1nccn1C(C)Cc1nc(N)nc(N)n1

nearest known ligand 0.51

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.51
HRH4 Q9H3N8 1/20 0.33
ADORA3 P0DMS8 1/20 0.31
ADORA2A P29274 1/20 0.31
ADORA2B P29275 1/20 0.31
ADORA1 P30542 1/20 0.31
KDM4E B2RXH2 1/20 0.30
NPC1 O15118 1/20 0.30
TP53 P04637 1/20 0.30
GAA P10253 1/20 0.30
RAB9A P51151 1/20 0.30
SMN1; SMN2 Q16637 1/20 0.30
CDK1 P06493 1/20 0.30
CCNB1 P14635 1/20 0.30
CCNE1 P24864 1/20 0.30
CDK2 P24941 1/20 0.30
ALDH1A1 P00352 1/20 0.30
POLB P06746 1/20 0.30
KMT2A Q03164 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1695645 0.76 TSHR (0.44) TSHRADORA3ADORA2AADORA2BADORA1
SCHEMBL2932043 0.72 KMT2A (0.41) TSHRADORA2AADORA2BADORA1ALDH1A1
SCHEMBL28563811 0.72 TSHR (0.44) TSHRHRH4ALDH1A1POLBKMT2A
SCHEMBL9460390 0.71 KMT2A (0.36) TSHRKDM4ESMN1; SMN2ALDH1A1POLB
SCHEMBL2793745 0.71 KMT2A (0.36) TSHRKDM4ESMN1; SMN2ALDH1A1POLB
Iodide SCHEMBL28407463 0.71 KMT2A (0.40) TSHRADORA2AADORA2BADORA1ALDH1A1
SCHEMBL9460005 0.71 KMT2A (0.36) TSHRKDM4ESMN1; SMN2ALDH1A1POLB
SCHEMBL20097939 0.70 TSHR (0.71) TSHRALDH1A1POLBKMT2A
SCHEMBL18789339 0.70 TSHR (0.41) TSHRHRH4KDM4EKMT2A
SCHEMBL28563331 0.70 TSHR (0.42) TSHRALDH1A1POLBKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1111972-B1 Flexible printed substrate SONY CHEM & INF DEVICE CORP (JP) 2007-05-23 EP claimed
US-7098267-B2 Polyamic acid varnish composition and a flexible printed board SONY CHEMICALS CORP. (JP) 2006-08-29 US claimed
US-20050027099-A1 Polyamic acid varnish composition and a flexible printed board SONY CHEMICALS CORP (JP) 2005-02-03 US claimed
US-6805967-B2 Polyamic acid varnish composition and a flexible printed board SONY CHEMICALS CORP. (JP) 2004-10-19 US claimed
EP-1108762-B1 Polyamic acid varnish composition and a flexible printed board SONY CHEMICALS CORP (JP) 2004-09-15 EP claimed
EP-1014765-B1 Flexible printed board, polyamic acid and polyamic acid varnish containing same SONY CHEMICALS CORP (JP) 2003-03-12 EP claimed
US-6395399-B2 METALLIC FOIL, E.G. COPPER, HAVING A POLYIMIDE LAYER PRODUCED BY FORMING A FILM OF A POLYAMIC ACID VARNISH FOLLOWED BY IMIDATING AND HAVING A SPECIFIC EXPANSION COEFFICIENT AND SOFTENING POINT; PRINTED CIRCUITS; NONCURLING SONY CHEMICALS CORP. (JP) 2002-05-28 US claimed
US-20010005730-A1 Polyamic acid varnish composition and a flexible printed board SONY CHEMICALS CORP. 2001-06-28 US claimed
EP-1111972-A2 Flexible printed substrate Sony Chemicals Corporation (JP) 2001-06-27 EP claimed
US-20010004496-A1 Flexible printed substrate SONY CHEMICALS CORP. 2001-06-21 US claimed
EP-1108762-A2 Polyamic acid varnish composition and a flexible printed board Sony Chemicals Corporation (JP) 2001-06-20 EP claimed
EP-1014765-A2 Flexible printed board, polyamic acid and polyamic acid varnish containing same Sony Chemicals Corporation (JP) 2000-06-28 EP claimed
US-8986833-B2 Enamel varnish composition for enamel wire and enamel wire using same LS CABLE LTD. (KR) 2015-03-24 US disclosed
EP-1355518-B1 FLEXIBLE PRINTED WIRING BOARD SONY CHEM & INF DEVICE CORP (JP) 2013-09-25 EP disclosed
US-7972693-B2 Enamel varnish composition for enamel wire and enamel wire using the same LS CABLE LTD. (KR) 2011-07-05 US disclosed
US-20090202830-A1 ENAMEL VARNISH COMPOSITION FOR ENAMEL WIRE AND ENAMEL WIRE USING SAME LS CABLE & SYSTEM LTD. (KR) 2009-08-13 US disclosed
EP-1111972-A2 Flexible printed substrate Sony Chemicals Corporation (JP) 2001-06-27 EP disclosed
US-20010004496-A1 Flexible printed substrate SONY CHEMICALS CORP. 2001-06-21 US disclosed
EP-1108762-A2 Polyamic acid varnish composition and a flexible printed board Sony Chemicals Corporation (JP) 2001-06-20 EP disclosed
EP-1014765-A2 Flexible printed board, polyamic acid and polyamic acid varnish containing same Sony Chemicals Corporation (JP) 2000-06-28 EP disclosed