SCHEMBL16970076

SCHEMBL16970076

CCCCCCCC(O)(O)Cl

nearest known ligand 0.48

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
FDPS P14324 10/20 0.48
GGPS1 O95749 7/20 0.48
SMPD1 P17405 2/20 0.46
TSHR P16473 1/20 0.44
THRB P10828 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16969780 1.00 FDPS (0.48) FDPSGGPS1SMPD1TSHRTHRB
SCHEMBL16969885 1.00 FDPS (0.48) FDPSGGPS1SMPD1TSHRTHRB
SCHEMBL16969890 1.00 FDPS (0.48) FDPSGGPS1SMPD1TSHRTHRB
SCHEMBL16970055 0.97
SCHEMBL891016 0.88
SCHEMBL16970300 0.83 FDPS (0.48) FDPSGGPS1SMPD1TSHRTHRB
SCHEMBL16969897 0.83 FDPS (0.48) FDPSGGPS1SMPD1TSHRTHRB
SCHEMBL16969827 0.83 FDPS (0.48) FDPSGGPS1SMPD1TSHRTHRB
SCHEMBL1484701 0.83 FDPS (0.48) FDPSGGPS1SMPD1TSHRTHRB
SCHEMBL30570453 0.81 FDPS (0.46) FDPSGGPS1SMPD1TSHRTHRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2905349-B1 Ag ball, solder joint, formed solder, solder paste and silver paste SENJU METAL INDUSTRY CO (JP) 2017-05-17 EP disclosed
US-9266196-B2 Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2016-02-23 US disclosed
EP-2905349-A2 Ag ball, Ag core ball, flux-coated Ag ball, flux-coated Ag core ball, solder joint, formed solder, solder paste and Ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2015-08-12 EP disclosed
US-20150217409-A1 Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BALL, SOLDER JOINT, FORMED SOLDER, SOLDER PASTE AND Ag PASTE Senju Metal lndustry Co., Ltd. (JP) 2015-08-06 US disclosed