SCHEMBL16970199

SCHEMBL16970199

CCCCCCCCCCCCCCCCCCCCC(C(=O)O)C(O)O

nearest known ligand 0.68

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
GPR84 Q9NQS5 8/20 0.63
FFAR1 O14842 2/20 0.63
MAPT P10636 1/20 0.55
LCK P06239 1/20 0.55
PPARD Q03181 1/20 0.55
ZDHHC20 Q5W0Z9 1/20 0.55
ZDHHC2 Q9UIJ5 1/20 0.55
FFAR4 Q5NUL3 1/20 0.52
ACE2 Q9BYF1 1/20 0.52
GRIK1 P39086 2/20 0.47
GRIK2 Q13002 2/20 0.47
FAAH O00519 1/20 0.45
SLC1A2 P43004 1/20 0.44
SLC1A1 P43005 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3441512 1.00 GPR84 (0.63) GPR84FFAR1MAPTLCKPPARD
SCHEMBL16969589 1.00 GPR84 (0.63) GPR84FFAR1MAPTLCKPPARD
SCHEMBL16969751 1.00 GPR84 (0.63) GPR84FFAR1MAPTLCKPPARD
SCHEMBL3465513 1.00 GPR84 (0.63) GPR84FFAR1MAPTLCKPPARD
SCHEMBL16969711 1.00 GPR84 (0.63) GPR84FFAR1MAPTLCKPPARD
SCHEMBL16970320 1.00 GPR84 (0.63) GPR84FFAR1MAPTLCKPPARD
SCHEMBL16969813 1.00 GPR84 (0.63) GPR84FFAR1MAPTLCKPPARD
SCHEMBL16970374 1.00 GPR84 (0.63) GPR84FFAR1MAPTLCKPPARD
SCHEMBL3466467 0.98 GPR84 (0.59) GPR84FFAR1MAPTLCKPPARD
SCHEMBL28205524 0.96 GPR84 (0.59) GPR84FFAR1MAPTLCKPPARD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3412796-B1 FILM MATERIAL AND COLD SPRAY METHOD TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP) 2021-09-15 EP disclosed
US-20180355487-A1 FILM MATERIAL AND COLD SPRAY METHOD TATSUTA ELECTRIC WIRE & CABLE CO., LTD. (JP) 2018-12-13 US disclosed
EP-3412796-A1 FILM MATERIAL AND COLD SPRAY METHOD Tatsuta Electric Wire & Cable Co., Ltd. (JP) 2018-12-12 EP disclosed
CN-104816104-B Ag balls, Ag cores ball, scaling powder coating Ag balls, scaling powder coating Ag cores ball, solder joints, forming solder, soldering paste 千住金属工业株式会社 2018-07-03 CN disclosed
EP-2905349-B1 Ag ball, solder joint, formed solder, solder paste and silver paste SENJU METAL INDUSTRY CO (JP) 2017-05-17 EP disclosed
US-9266196-B2 Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2016-02-23 US disclosed
EP-2905349-A2 Ag ball, Ag core ball, flux-coated Ag ball, flux-coated Ag core ball, solder joint, formed solder, solder paste and Ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2015-08-12 EP disclosed
US-20150217409-A1 Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BALL, SOLDER JOINT, FORMED SOLDER, SOLDER PASTE AND Ag PASTE Senju Metal lndustry Co., Ltd. (JP) 2015-08-06 US disclosed
CN-104816104-A Ag ball, Ag core ball, flux-coated Ag ball, flux-coated Ag core ball, solder joint, formed solder, solder paste SENJU METAL INDUSTRY CO 2015-08-05 CN disclosed