SCHEMBL16977288

SCHEMBL16977288

CC(C)(C1CCC(OCC2CO2)CC1)C1CCC(C(C)(C2CCC(OCC3CO3)CC2)C2CCC(OCC3CO3)CC2)CC1

nearest known ligand 0.41

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.41
TSHR P16473 4/20 0.39
MAPK1 P28482 1/20 0.39
SMN1; SMN2 Q16637 1/20 0.34
TP53 P04637 2/20 0.33
MAPT P10636 2/20 0.33
HPGD P15428 2/20 0.33
MEN1 O00255 1/20 0.33
CYP1A2 P05177 1/20 0.33
KMT2A Q03164 1/20 0.33
PPARG P37231 1/20 0.33
HIF1A Q16665 1/20 0.33
TDP1 Q9NUW8 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL50372 0.95 ALDH1A1 (0.45) ALDH1A1TSHRMAPK1SMN1; SMN2TP53
SCHEMBL12957809 0.95 ALDH1A1 (0.45) ALDH1A1TSHRMAPK1SMN1; SMN2TP53
SCHEMBL17083647 0.95 ALDH1A1 (0.45) ALDH1A1TSHRMAPK1SMN1; SMN2TP53
SCHEMBL26498502 0.95 ALDH1A1 (0.45) ALDH1A1TSHRMAPK1SMN1; SMN2TP53
SCHEMBL22540509 0.90 ALDH1A1 (0.41) ALDH1A1TSHRMAPK1SMN1; SMN2TP53
SCHEMBL12190040 0.90 ALDH1A1 (0.41) ALDH1A1TSHRMAPK1SMN1; SMN2TP53
SCHEMBL15683202 0.90 ALDH1A1 (0.41) ALDH1A1TSHRMAPK1SMN1; SMN2TP53
SCHEMBL17083532 0.88 ALDH1A1 (0.40) ALDH1A1TSHRMAPK1SMN1; SMN2TP53
SCHEMBL14392124 0.88 ALDH1A1 (0.40) ALDH1A1TSHRMAPK1SMN1; SMN2TP53
SCHEMBL8758845 0.88 ALDH1A1 (0.40) ALDH1A1TSHRMAPK1SMN1; SMN2TP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3173434-B1 THERMOSETTING RESIN COMPOSITION AND MOLDED BODY THEREOF MITSUBISHI CHEM CORP (JP) 2019-11-20 EP disclosed
EP-3173434-A1 THERMOSETTING RESIN COMPOSITION AND MOLDED BODY THEREOF MITSUBISHI CHEMICAL CORPORATION (JP) 2017-05-31 EP disclosed
US-20170130006-A1 THERMOSETTING RESIN COMPOSITION AND MOLDED BODY THEREOF MITSUBISHI CHEMICAL CORPORATION (JP) 2017-05-11 US disclosed
US-20170130006-A1 THERMOSETTING RESIN COMPOSITION AND MOLDED BODY THEREOF MITSUBISHI CHEMICAL CORPORATION (JP) 2017-05-11 US disclosed
US-9550877-B2 Thermosetting resin composition, method for producing same, method for producing cured resin product, and method for causing self-polymerization of epoxy compound MITSUBISHI CHEMICAL CORPORATION (JP) 2017-01-24 US disclosed
US-9550877-B2 Thermosetting resin composition, method for producing same, method for producing cured resin product, and method for causing self-polymerization of epoxy compound MITSUBISHI CHEMICAL CORPORATION (JP) 2017-01-24 US disclosed
US-20150240070-A1 THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING SAME, METHOD FOR PRODUCING CURED RESIN PRODUCT, AND METHOD FOR CAUSING SELF-POLYMERIZATION OF EPOXY COMPOUND MITSUBISHI CHEMICAL CORPORATION (JP) 2015-08-27 US disclosed
US-20150240070-A1 THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING SAME, METHOD FOR PRODUCING CURED RESIN PRODUCT, AND METHOD FOR CAUSING SELF-POLYMERIZATION OF EPOXY COMPOUND MITSUBISHI CHEMICAL CORPORATION (JP) 2015-08-27 US disclosed
EP-2902441-A1 THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING SAME, METHOD FOR PRODUCING CURED RESIN PRODUCT, AND METHOD FOR CAUSING SELF-POLYMERIZATION OF EPOXY COMPOUND Mitsubishi Chemical Corporation (JP) 2015-08-05 EP disclosed