Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5162942 | 0.79 | — | — | |
| SCHEMBL8993350 | 0.77 | — | — | |
| SCHEMBL4159663 | 0.77 | — | — | |
| SCHEMBL101280 | 0.69 | — | — | |
| SCHEMBL2019340 | 0.69 | TSHR (0.38) | TSHRLMNA | |
| SCHEMBL1794156 | 0.67 | — | — | |
| SCHEMBL11501255 | 0.67 | — | — | |
| SCHEMBL10553508 | 0.67 | ALDH1A1 (0.53) | TSHRLMNA | |
| SCHEMBL9335555 | 0.67 | ALDH1A1 (0.53) | TSHRLMNA | |
| Charcoal, Activated SCHEMBL7916448 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1394 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240192601-A1 | PHOTORESIST TOP COATING MATERIAL FOR ETCHING RATE CONTROL | TAIWAN SEMICONDUCTOR MFG CO LTD (TW) | 2024-06-13 | — | — | US | claimed |
| CN-114911133-A | Method for patterning a stack and manufacturing a semiconductor structure | 台湾积体电路制造股份有限公司 | 2022-08-16 | — | — | CN | claimed |
| US-20210294212-A1 | PHOTORESIST COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2021-09-23 | — | — | US | claimed |
| EP-1811339-B1 | Pattern forming method | FUJIFILM CORP (JP) | 2021-03-17 | — | — | EP | claimed |
| EP-2756353-B1 | PATTERN-FORMING METHOD, ELECTRON BEAM-SENSITIVE OR EXTREME ULTRAVIOLET RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, MANUFACTURING METHOD OF ELECTRONIC DEVICE USING THEM AND ELECTRONIC DEVICE | FUJIFILM CORP (JP) | 2019-05-01 | — | — | EP | claimed |
| US-9557643-B2 | Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, resist film, manufacturing method of electronic device using the same and electronic device | FUJIFILM CORPORATION (JP) | 2017-01-31 | — | — | US | claimed |
| US-9411230-B2 | Pattern forming method, electron beam-sensitive or extreme ultraviolet-sensitive composition, resist film, method for manufacturing electronic device using the same, and electronic device | FUJIFILM CORPORATION (JP) | 2016-08-09 | — | — | US | claimed |
| US-20150355541-A1 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY- OR RADIATION-SENSITIVE FILM AND PATTERN FORMING METHOD | FUJIFILM CORPORATION (JP) | 2015-12-10 | — | — | US | claimed |
| US-9170489-B2 | Pattern-forming method, electron beam-sensitive or extreme ultraviolet radiation-sensitive resin composition, resist film, manufacturing method of electronic device using them and electronic device | FUJIFILM CORPORATION (JP) | 2015-10-27 | — | — | US | claimed |
| US-20140349224-A1 | PATTERN FORMING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, MANUFACTURING METHOD OF ELECTRONIC DEVICE USING THE SAME AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2014-11-27 | — | — | US | claimed |
| EP-2761374-A1 | PATTERN FORMING METHOD, ELECTRON BEAM-SENSITIVE OR EXTREME ULTRAVIOLET-SENSITIVE COMPOSITION, RESIST FILM, METHOD FOR MANUFACTURING ELECTRONIC DEVICE USING THE SAME, AND ELECTRONIC DEVICE | Fujifilm Corporation (JP) | 2014-08-06 | — | — | EP | claimed |
| US-20140212796-A1 | PATTERN FORMING METHOD, ELECTRON BEAM-SENSITIVE OR EXTREME ULTRAVIOLET-SENSITIVE COMPOSITION, RESIST FILM, METHOD FOR MANUFACTURING ELECTRONIC DEVICE USING THE SAME, AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2014-07-31 | — | — | US | claimed |
| EP-2756353-A1 | PATTERN-FORMING METHOD, ELECTRON BEAM-SENSITIVE OR EXTREME ULTRAVIOLET RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, MANUFACTURING METHOD OF ELECTRONIC DEVICE USING THEM AND ELECTRONIC DEVICE | FUJIFILM Corporation (JP) | 2014-07-23 | — | — | EP | claimed |
| US-20140193749-A1 | PATTERN-FORMING METHOD, ELECTRON BEAM-SENSITIVE OR EXTREME ULTRAVIOLET RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, MANUFACTURING METHOD OF ELECTRONIC DEVICE USING THEM AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2014-07-10 | — | — | US | claimed |
| WO-2013118851-A1 | PATTERN FORMING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, MANUFACTURING METHOD OF ELECTRONIC DEVICE USING THE SAME AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2013-08-15 | — | — | WO | claimed |
| WO-2013047396-A1 | PATTERN FORMING METHOD, ELECTRON BEAM-SENSITIVE OR EXTREME ULTRAVIOLET-SENSITIVE COMPOSITION, RESIST FILM, METHOD FOR MANUFACTURING ELECTRONIC DEVICE USING THE SAME, AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2013-04-04 | — | — | WO | claimed |
| WO-2013039243-A1 | PATTERN-FORMING METHOD, ELECTRON BEAM-SENSITIVE OR EXTREME ULTRAVIOLET RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, MANUFACTURING METHOD OF ELECTRONIC DEVICE USING THEM AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2013-03-21 | — | — | WO | claimed |
| US-8053161-B2 | Improved in line edge roughness not only in ordinary exposure (dry exposure) but also in immersion exposure | FUJIFILM CORPORATION (JP) | 2011-11-08 | — | — | US | claimed |
| US-7842452-B2 | Pattern forming method | FUJIFILM CORPORATION (JP) | 2010-11-30 | — | — | US | claimed |
| US-20090123880-A1 | PATTERN FORMING METHOD | FUJIFILM CORPORATION (JP) | 2009-05-14 | — | — | US | claimed |