Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 1/20 | 0.50 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.35 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.33 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.33 |
| ▸ | HCAR2 | Q8TDS4 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Acrylic Acid SCHEMBL1706220 | 1.00 | LMNA (0.50) | LMNAALDH1A1ALOX15HSD17B10HCAR2 | |
| Acrylic Acid SCHEMBL8346283 | 0.87 | LMNA (0.53) | LMNAALDH1A1ALOX15HSD17B10 | |
| Bicarbonate SCHEMBL1953130 | 0.84 | — | — | |
| Acrylic Acid SCHEMBL9720082 | 0.81 | LMNA (0.59) | LMNAALDH1A1ALOX15HSD17B10HCAR2 | |
| Acetic Acid SCHEMBL1092943 | 0.81 | — | — | |
| Acrylic Acid SCHEMBL6856274 | 0.78 | — | — | |
| Acrylic Acid SCHEMBL235880 | 0.78 | — | — | |
| Acrylic Acid SCHEMBL11402222 | 0.78 | LMNA (0.71) | LMNAALDH1A1ALOX15HSD17B10HCAR2 | |
| Acrylic Acid SCHEMBL9407315 | 0.78 | LMNA (0.71) | LMNAALDH1A1ALOX15HSD17B10 | |
| Acrylic Acid SCHEMBL28084503 | 0.78 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3398975-B1 | PHOTOSENSITIVE COMPOSITION | SAN APRO LTD (JP) | 2023-02-01 | — | — | EP | disclosed |
| CN-105467765-B | Photosensitive composition, method for producing cured film, and use thereof | 富士胶片株式会社 | 2020-04-24 | — | — | CN | disclosed |
| US-20180373145-A1 | PHOTOSENSITIVE COMPOSITION | SAN-APRO LTD. (JP) | 2018-12-27 | — | — | US | disclosed |
| EP-3398975-A1 | PHOTOSENSITIVE COMPOSITION | San-Apro Limited (JP) | 2018-11-07 | — | — | EP | disclosed |
| US-9966295-B2 | Temporary bonding laminates for use in manufacture of semiconductor devices and method for manufacturing semiconductor devices | FUJIFILM CORPORATION (JP) | 2018-05-08 | — | — | US | disclosed |
| US-9716025-B2 | Temporary bonding laminates for use in manufacture of semiconductor devices | FUJIFILM CORPORATION (JP) | 2017-07-25 | — | — | US | disclosed |
| US-9716024-B2 | Temporary bonding laminates for used in manufacture of semiconductor devices | FUJIFILM CORPORATION (JP) | 2017-07-25 | — | — | US | disclosed |
| US-20170012022-A1 | PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2017-01-12 | — | — | US | disclosed |
| US-20160104635-A1 | TEMPORARY BONDING LAMINATES FOR USED IN MANUFACTURE OF SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING SEMICONDUCTOR DEVICES | FUJIFILM CORPORATION (JP) | 2016-04-14 | — | — | US | disclosed |
| US-20160035612-A1 | TEMPORARY BONDING LAMINATES FOR USED IN MANUFACTURE OF SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING SEMICONDUCTOR DEVICES | FUJIFILM CORPORATION (JP) | 2016-02-04 | — | — | US | disclosed |
| US-20160013088-A1 | TEMPORARY BONDING LAMINATES FOR USED IN MANUFACTURE OF SEMICONDUCTOR DEVICES AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES | FUJIFILM CORPORATION (JP) | 2016-01-14 | — | — | US | disclosed |
| US-8853290-B2 | Photosensitive composition | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2014-10-07 | — | — | US | disclosed |
| US-20120142806-A1 | PHOTOSENSITIVE COMPOSITION | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2012-06-07 | — | — | US | disclosed |
| EP-2441778-A1 | PHOTOSENSITIVE COMPOSITION | Sanyo Chemical Industries, Ltd. (JP) | 2012-04-18 | — | — | EP | disclosed |