SCHEMBL17069986

SCHEMBL17069986

Cc1ccccc1C(=O)c1ccc(Sc2ccc(C(=O)/C(=N\O)c3ccccc3C)cc2)cc1

nearest known ligand 0.42

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
LMNA P02545 2/20 0.42
MEN1 O00255 2/20 0.42
KMT2A Q03164 2/20 0.42
MAPT P10636 1/20 0.42
MAPK13 O15264 2/20 0.41
MAPK12 P53778 2/20 0.41
MAPK11 Q15759 2/20 0.41
MAPK14 Q16539 2/20 0.41
ALDH1A1 P00352 5/20 0.40
HPGD P15428 2/20 0.40
HTT P42858 1/20 0.39
AKR1C3 P42330 1/20 0.38
CHEK2 O96017 1/20 0.37
L3MBTL1 Q9Y468 2/20 0.37
FFAR1 O14842 1/20 0.36
POLB P06746 1/20 0.35
NPC1 O15118 1/20 0.34
RAB9A P51151 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17069984 0.93 HPGD (0.42) LMNAMEN1KMT2AMAPTALDH1A1
SCHEMBL23877647 0.92 HPGD (0.49) LMNAMEN1KMT2AMAPTALDH1A1
SCHEMBL17069985 0.92 HPGD (0.49) LMNAMEN1KMT2AMAPTALDH1A1
SCHEMBL23877646 0.92 HPGD (0.49) LMNAMEN1KMT2AMAPTALDH1A1
SCHEMBL17069993 0.90 CDC25B (0.41) LMNAMEN1KMT2AMAPTALDH1A1
Acetic Acid SCHEMBL23929045 0.89 HPGD (0.50) LMNAMEN1KMT2AMAPTALDH1A1
Acetic Acid SCHEMBL23929044 0.89 HPGD (0.50) LMNAMEN1KMT2AMAPTALDH1A1
SCHEMBL17069982 0.87 MEN1 (0.39) LMNAMEN1KMT2AMAPTALDH1A1
SCHEMBL17069987 0.84 NPC1 (0.50) LMNAMEN1KMT2AMAPTALDH1A1
SCHEMBL17069944 0.84 KMT2A (0.41) LMNAMEN1KMT2AMAPTMAPK13

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9683150-B2 Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material TOKYO OHKA KOGYO CO., LTD. (JP) 2017-06-20 US disclosed
US-9683150-B2 Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material TOKYO OHKA KOGYO CO., LTD. (JP) 2017-06-20 US disclosed
US-20170115563-A1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2017-04-27 US disclosed
US-20170115563-A1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2017-04-27 US disclosed
EP-2930200-B1 Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material TOKYO OHKA KOGYO CO LTD (JP) 2016-07-20 EP disclosed
WO-2015198887-A1 ENERGY-SENSITIVE RESIN COMPOSITION 東京応化工業株式会社 2015-12-30 WO disclosed
EP-2930200-A1 Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material TOKYO OHKA KOGYO CO., LTD. (JP) 2015-10-14 EP disclosed
US-20150252229-A1 CURABLE COMPOSITION, ADHESIVE, METHOD OF PRODUCING FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL TOKYO OHKA KOGYO CO., LTD. (JP) 2015-09-10 US disclosed
US-20150252229-A1 CURABLE COMPOSITION, ADHESIVE, METHOD OF PRODUCING FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL TOKYO OHKA KOGYO CO., LTD. (JP) 2015-09-10 US disclosed