Known targets — ChEMBL curated mechanism
The experimentally established mechanism targets of Silver. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HAO1 | Q9UJM8 | 1/20 | 0.61 |
| ▸ | CES2 | O00748 | 4/20 | 0.54 |
| ▸ | CES1 | P23141 | 4/20 | 0.54 |
| ▸ | MAPT | P10636 | 1/20 | 0.50 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.50 |
| ▸ | CA1 | P00915 | 1/20 | 0.50 |
| ▸ | FABP3 | P05413 | 5/20 | 0.48 |
| ▸ | AKR1B1 | P15121 | 1/20 | 0.46 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.45 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.44 |
| ▸ | TSHR | P16473 | 1/20 | 0.44 |
| ▸ | SLC22A6 | Q4U2R8 | 1/20 | 0.44 |
| ▸ | SLC22A8 | Q8TCC7 | 1/20 | 0.44 |
| ▸ | GPR84 | Q9NQS5 | 1/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Silver SCHEMBL17075603 | 0.98 | HAO1 (0.64) | HAO1CES2CES1MAPTKMT2A | |
| SCHEMBL28225602 | 0.95 | HAO1 (0.61) | HAO1CES2CES1MAPTKMT2A | |
| SCHEMBL28346735 | 0.95 | HAO1 (0.61) | HAO1CES2CES1MAPTKMT2A | |
| SCHEMBL29374985 | 0.95 | HAO1 (0.61) | HAO1CES2CES1MAPTKMT2A | |
| SCHEMBL1304207 | 0.95 | HAO1 (0.61) | HAO1CES2CES1MAPTKMT2A | |
| SCHEMBL29035603 | 0.95 | HAO1 (0.61) | HAO1CES2CES1MAPTKMT2A | |
| SCHEMBL531121 | 0.95 | HAO1 (0.61) | HAO1CES2CES1MAPTKMT2A | |
| SCHEMBL28913631 | 0.95 | HAO1 (0.61) | HAO1CES2CES1MAPTKMT2A | |
| SCHEMBL1304419 | 0.95 | HAO1 (0.61) | HAO1CES2CES1MAPTKMT2A | |
| SCHEMBL29674754 | 0.95 | HAO1 (0.61) | HAO1CES2CES1MAPTKMT2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10040960-B2 | Silver ink composition, conductor and communication device | TOPPAN FORMS CO., LTD. (JP) | 2018-08-07 | — | — | US | claimed |
| US-20150259557-A1 | SILVER INK COMPOSITION, CONDUCTOR AND COMMUNICATION DEVICE | TOPPAN FORMS CO., LTD (JP) | 2015-09-17 | — | — | US | claimed |
| US-12119131-B2 | Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part | SENJU METAL INDUSTRY CO., LTD. (JP) | 2024-10-15 | — | — | US | disclosed |
| CN-112301346-B | Method for synthesizing copper-silver alloy, method for forming conductive part, copper-silver alloy, and conductive part | 千住金属工业株式会社 | 2023-02-28 | — | — | CN | disclosed |
| US-11217359-B2 | Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part | SENJU METAL INDUSTRY CO., LTD. (JP) | 2022-01-04 | — | — | US | disclosed |
| US-20210366627-A1 | METHOD FOR SYNTHESIZING COPPER-SILVER ALLOY, METHOD FOR FORMING CONDUCTION PART, COPPER-SILVER ALLOY, AND CONDUCTION PART | SENJU METAL INDUSTRY CO., LTD. (JP) | 2021-11-25 | — | — | US | disclosed |
| CN-111032912-B | Method for synthesizing copper-silver alloy, method for forming conductive part, copper-silver alloy, and conductive part | 千住金属工业株式会社 | 2021-03-09 | — | — | CN | disclosed |
| CN-112301346-A | Method for synthesizing copper-silver alloy, method for forming conductive part, copper-silver alloy, and conductive part | 千住金属工业株式会社 | 2021-02-02 | — | — | CN | disclosed |
| US-20200381136-A1 | METHOD FOR SYNTHESIZING COPPER-SILVER ALLOY, METHOD FOR FORMING CONDUCTION PART, COPPER-SILVER ALLOY, AND CONDUCTION PART | SENJU METAL INDUSTRY CO., LTD. (JP) | 2020-12-03 | — | — | US | disclosed |
| EP-3660185-A1 | METHOD FOR SYNTHESIZING COPPER-SILVER ALLOY, METHOD FOR FORMING CONDUCTION PART, COPPER-SILVER ALLOY, AND CONDUCTION PART | Senju Metal Industry Co., Ltd (JP) | 2020-06-03 | — | — | EP | disclosed |
| CN-111032912-A | Method for synthesizing copper-silver alloy, method for forming conductive part, copper-silver alloy, and conductive part | 千住金属工业株式会社 | 2020-04-17 | — | — | CN | disclosed |
| CN-106416432-B | Wiring board | 凸版资讯股份有限公司 | 2020-03-24 | — | — | CN | disclosed |
| US-10477679-B2 | Method for producing wiring board | TOPPAN FORMS CO., LTD. (JP) | 2019-11-12 | — | — | US | disclosed |
| US-10040960-B2 | Silver ink composition, conductor and communication device | TOPPAN FORMS CO., LTD. (JP) | 2018-08-07 | — | — | US | disclosed |
| US-20180153034-A1 | WIRING BOARD | TOPPAN FORMS CO., LTD. (JP) | 2018-05-31 | — | — | US | disclosed |
| US-20160330835-A1 | WIRING BOARD | TOPPAN FORMS CO., LTD. (JP) | 2016-11-10 | — | — | US | disclosed |
| US-20150259557-A1 | SILVER INK COMPOSITION, CONDUCTOR AND COMMUNICATION DEVICE | TOPPAN FORMS CO., LTD (JP) | 2015-09-17 | — | — | US | disclosed |