SCHEMBL17102770

SCHEMBL17102770

C[SiH](C)N1CCCCC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15310015 0.96
SCHEMBL23456676 0.81
SCHEMBL17102753 0.79 MGLL (0.30)
SCHEMBL28864923 0.73
SCHEMBL17711152 0.71
SCHEMBL21851774 0.71
SCHEMBL31722627 0.71
SCHEMBL9621174 0.69 MGLL (0.33)
SCHEMBL12506386 0.69
SCHEMBL30688728 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 85 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12518966-B2 Selective plasma enhanced atomic layer deposition VERSUM MATERIALS US, LLC (US) 2026-01-06 US claimed
US-20250270698-A1 BORON-CONTAINING PRECURSORS FOR THE ALD DEPOSITION OF BORON NITRIDE FILMS VERSUM MATERIALS US, LLC 2025-08-28 US claimed
EP-4493734-A1 BORON-CONTAINING PRECURSORS FOR THE ALD DEPOSITION OF BORON NITRIDE FILMS Versum Materials US, LLC (US) 2025-01-22 EP claimed
CN-119213168-A Boron-containing precursors for ALD deposition of boron nitride films 弗萨姆材料美国有限责任公司 2024-12-27 CN claimed
US-20240047196-A1 SELECTIVE THERMAL ATOMIC LAYER DEPOSITION VERSUM MAT US LLC (US) 2024-02-08 US claimed
US-20240014036-A1 SELECTIVE PLASMA ENHANCED ATOMIC LAYER DEPOSITION VERSUM MATERIALS US, LLC 2024-01-11 US claimed
CN-116918029-A selective thermal atomic layer deposition 弗萨姆材料美国有限责任公司 2023-10-20 CN claimed
WO-2023201271-A1 BORON-CONTAINING PRECURSORS FOR THE ALD DEPOSITION OF BORON NITRIDE FILMS VERSUM MATERIALS US, LLC (US) 2023-10-19 WO claimed
CN-116761906-A Selective plasma enhanced atomic layer deposition 弗萨姆材料美国有限责任公司 2023-09-15 CN claimed
EP-4240886-A1 SELECTIVE PLASMA ENHANCED ATOMIC LAYER DEPOSITION Versum Materials US, LLC (US) 2023-09-13 EP claimed
EP-4241299-A1 SELECTIVE THERMAL ATOMIC LAYER DEPOSITION Versum Materials US, LLC (US) 2023-09-13 EP claimed
EP-3663301-B1 BORON-CONTAINING COMPOUNDS, COMPOSITIONS, AND METHODS FOR THE DEPOSITION OF BORON CONTAINING FILMS VERSUM MAT US LLC (US) 2023-08-30 EP claimed
WO-2022119860-A9 SELECTIVE THERMAL ATOMIC LAYER DEPOSITION VERSUM MATERIAL US, LLC (US) 2023-08-24 WO claimed
WO-2022119865-A1 SELECTIVE PLASMA ENHANCED ATOMIC LAYER DEPOSITION VERSUM MATERIALS US, LLC (US) 2022-06-09 WO claimed
WO-2022119860-A1 SELECTIVE THERMAL ATOMIC LAYER DEPOSITION VERSUM MATERIAL US, LLC (US) 2022-06-09 WO claimed
CN-113088927-A Compositions and methods for depositing silicon oxide films 弗萨姆材料美国有限责任公司 2021-07-09 CN claimed
US-20150275355-A1 COMPOSITIONS AND METHODS FOR THE DEPOSITION OF SILICON OXIDE FILMS AIR PRODUCTS AND CHEMICALS, INC. (US) 2015-10-01 US claimed
EP-2924143-A1 COMPOSITIONS AND METHODS FOR THE DEPOSITION OF SILICON OXIDE FILMS AIR PRODUCTS AND CHEMICALS, INC. (US) 2015-09-30 EP claimed
US-20260082833-A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM Kokusai Electric Corporation (JP) 2026-03-19 US disclosed
EP-2924143-A1 COMPOSITIONS AND METHODS FOR THE DEPOSITION OF SILICON OXIDE FILMS AIR PRODUCTS AND CHEMICALS, INC. (US) 2015-09-30 EP disclosed