SCHEMBL17134

SCHEMBL17134

C[Si](C)(C)O[Si](C)(C)CCCCl

nearest known ligand 0.30

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.30
TDP1 Q9NUW8 2/20 0.30
ALDH1A1 P00352 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1482678 0.89 TSHR (0.33) TSHRTDP1ALDH1A1
SCHEMBL10093779 0.83
SCHEMBL10892433 0.82
SCHEMBL10886518 0.82
SCHEMBL27417327 0.82
SCHEMBL8006763 0.81 TSHR (0.35) TSHRTDP1ALDH1A1
SCHEMBL17123471 0.80
SCHEMBL18978918 0.80
SCHEMBL1241954 0.79 TSHR (0.30) TSHRTDP1ALDH1A1
SCHEMBL8446358 0.79 TSHR (0.39) TSHRTDP1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 503 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025106343-A1 ETCHING METHODS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2025-05-22 WO claimed
US-20250157825-A1 ETCHING METHODS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2025-05-15 US claimed
CN-118894677-B Nanometer microporous heat-insulating plate and preparation method thereof 南通福美新材料有限公司 2024-12-20 CN claimed
CN-118894677-A Nanometer microporous heat-insulating plate and preparation method thereof 南通福美新材料有限公司 2024-11-05 CN claimed
US-20240258111-A1 Surface Treatment Compositions and Methods FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2024-08-01 US claimed
US-11447642-B2 Methods of using surface treatment compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2022-09-20 US claimed
US-11174394-B2 Surface treatment compositions and articles containing same FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2021-11-16 US claimed
EP-3830196-A1 SURFACE TREATMENT COMPOSITIONS AND METHODS FUJIFILM Electronic Materials U.S.A, Inc. (US) 2021-06-09 EP claimed
US-20210122925-A1 METHODS OF USING SURFACE TREATMENT COMPOSITIONS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2021-04-29 US claimed
CN-112513192-A Surface treatment composition and method 富士胶片电子材料美国有限公司 2021-03-16 CN claimed
US-20190211210-A1 SURFACE TREATMENT COMPOSITIONS AND METHODS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2019-07-11 US claimed
WO-2019135901-A1 SURFACE TREATMENT COMPOSITIONS AND METHODS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2019-07-11 WO claimed
EP-1309306-A2 WATER-IN-OIL EMULSION COMPOSITIONS COMPRISING POLYALKYLENE GLYCOL STYLING AGENTS THE PROCTER & GAMBLE COMPANY (US) 2003-05-14 EP claimed
WO-2002011684-A2 WATER-IN-OIL EMULSION COMPOSITIONS COMPRISING POLYALKYLENE GLYCOL STYLING AGENTS THE PROCTER & GAMBLE COMPANY (US) 2002-02-14 WO claimed
US-6300027-B1 Low surface energy photoreceptors XEROX CORPORATION 2001-10-09 US claimed
JP-2001507372-A 2001-06-05 JP claimed
CN-1261776-A Personal care compositions containing grafted polymers PROCTER & GAMBLE (US) 2000-08-02 CN claimed
EP-0977540-A1 PERSONAL CARE COMPOSITIONS CONTAINING GRAFT POLYMERS THE PROCTER & GAMBLE COMPANY (US) 2000-02-09 EP claimed
WO-1998051261-A1 PERSONAL CARE COMPOSITIONS CONTAINING GRAFT POLYMERS THE PROCTER & GAMBLE COMPANY (US) 1998-11-19 WO claimed
EP-0649887-A2 Water-repellant and antiseptic coating composition DOW CORNING ASIA, Ltd. (JP) 1995-04-26 EP claimed