⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Diethylaminoethanol SCHEMBL3114 | 0.87 | — | — | |
| Diethylaminoethanol SCHEMBL10699915 | 0.87 | — | — | |
| SCHEMBL35602 | 0.87 | — | — | |
| Diethylaminoethanol SCHEMBL3296548 | 0.84 | — | — | |
| Diethylaminoethanol SCHEMBL20815437 | 0.84 | — | — | |
| Trolamine SCHEMBL220505 | 0.84 | CYP1A2 (0.52) | — | |
| Iodide SCHEMBL15392134 | 0.84 | CYP1A2 (0.58) | — | |
| Trolamine SCHEMBL22749413 | 0.84 | CYP1A2 (0.52) | — | |
| Diethylaminoethanol SCHEMBL3848943 | 0.84 | — | — | |
| Diethylaminoethanol SCHEMBL8786270 | 0.84 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-108693718-B | Resist stripping liquid composition | 东友精细化工有限公司 | 2022-07-29 | — | — | CN | claimed |
| CN-108693718-A | Anticorrosive additive stripping liquid controlling composition | 东友精细化工有限公司 | 2018-10-23 | — | — | CN | claimed |
| EP-1031884-B1 | Resist stripping agent and process of producing semiconductor devices using the same | MITSUBISHI GAS CHEMICAL CO (JP) | 2012-01-11 | — | — | EP | claimed |
| US-6638694-B2 | Mixtures of amines, water soluble solvents and corrosion resistance agents, used for removing photoresist films and residues after etching semiconductor integrated circuits or liquid crystal displays | MITSUBISHI GAS CHEMICAL COMPANY, INC (JP) | 2003-10-28 | — | — | US | claimed |
| US-20030186175-A1 | RESIST STRIPPING AGENT AND PROCESS OF PRODUCING SEMICONDUCTOR DEVICES USING THE SAME | IKEMOTO KAZUTO (JP) | 2003-10-02 | — | — | US | claimed |
| EP-1031884-A2 | Resist stripping agent and process of producing semiconductor devices using the same | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2000-08-30 | — | — | EP | claimed |
| US-11649334-B2 | Water-soluble composition, production method for cured product thereof, and cured product thereof, and acyl phosphinate | ADEKA CORPORATION (JP) | 2023-05-16 | — | — | US | disclosed |
| CN-108693718-B | Resist stripping liquid composition | 东友精细化工有限公司 | 2022-07-29 | — | — | CN | disclosed |
| CN-108693718-A | Anticorrosive additive stripping liquid controlling composition | 东友精细化工有限公司 | 2018-10-23 | — | — | CN | disclosed |
| EP-2688554-A2 | OPTIMISED PREPARATIONS OF HIGHLY ADAPTABLE AGGREGATES | Cevc, Gregor (DE) | 2014-01-29 | — | — | EP | disclosed |
| US-20140017302-A1 | OPTIMISED PREPARATIONS OF HIGHLY ADAPTABLE AGGREGATES | CEVC GREGOR (DE) | 2014-01-16 | — | — | US | disclosed |
| WO-2012126966-A2 | OPTIMISED PREPARATIONS OF HIGHLY ADAPTABLE AGGREGATES | CEVC GREGOR (DE) | 2012-09-27 | — | — | WO | disclosed |
| US-8163095-B2 | Composition for stripping and stripping method | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2012-04-24 | — | — | US | disclosed |
| EP-1545462-A2 | DENDRIMERS AS MOLECULAR TRANSLOCATORS | The Regents of the University of California (US) | 2005-06-29 | — | — | EP | disclosed |
| US-20040048761-A1 | Cleaning composition | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2004-03-11 | — | — | US | disclosed |
| WO-2004009665-A2 | DENDRIMERS AS MOLECULAR TRANSLOCATORS | THE REGENTS OF THE UNIVERSITY OF CALIFORNIA (US) | 2004-01-29 | — | — | WO | disclosed |
| WO-2004009666-A2 | DENDRIMERS AS MOLECULAR TRANSLOCATORS | THE REGENTS OF THE UNIVERSITY OF CALIFORNIA (US) | 2004-01-29 | — | — | WO | disclosed |
| US-6638694-B2 | Mixtures of amines, water soluble solvents and corrosion resistance agents, used for removing photoresist films and residues after etching semiconductor integrated circuits or liquid crystal displays | MITSUBISHI GAS CHEMICAL COMPANY, INC (JP) | 2003-10-28 | — | — | US | disclosed |
| US-20030186175-A1 | RESIST STRIPPING AGENT AND PROCESS OF PRODUCING SEMICONDUCTOR DEVICES USING THE SAME | IKEMOTO KAZUTO (JP) | 2003-10-02 | — | — | US | disclosed |
| EP-1031884-A2 | Resist stripping agent and process of producing semiconductor devices using the same | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2000-08-30 | — | — | EP | disclosed |