SCHEMBL17240331

SCHEMBL17240331

C=C(CCCCCCCCCCCCCCCCCO)C(=O)O

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GPR84 Q9NQS5 1/20 0.56
FFAR1 O14842 1/20 0.56
FFAR4 Q5NUL3 1/20 0.56
FNTA P49354 2/20 0.48
FNTB P49356 2/20 0.48
TBXAS1 P24557 2/20 0.44
CAMK2A Q9UQM7 1/20 0.42
KDM4E B2RXH2 1/20 0.41
SMN1; SMN2 Q16637 1/20 0.41
LMNA P02545 2/20 0.39
TSHR P16473 1/20 0.39
NFKB1 P19838 1/20 0.39
PMP22 Q01453 1/20 0.39
GAA P10253 1/20 0.35
TET2 Q6N021 3/20 0.34
TET3 O43151 1/20 0.34
TET1 Q8NFU7 1/20 0.34
THRB P10828 1/20 0.34
PGGT1B P53609 1/20 0.34
GRIK1 P39086 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL148880 1.00 GPR84 (0.56) GPR84FFAR1FFAR4FNTAFNTB
SCHEMBL157090 1.00 GPR84 (0.56) GPR84FFAR1FFAR4FNTAFNTB
SCHEMBL17240335 1.00 GPR84 (0.56) GPR84FFAR1FFAR4FNTAFNTB
SCHEMBL43807 1.00 GPR84 (0.56) GPR84FFAR1FFAR4FNTAFNTB
SCHEMBL743707 1.00 GPR84 (0.56) GPR84FFAR1FFAR4FNTAFNTB
SCHEMBL136691 1.00 GPR84 (0.56) GPR84FFAR1FFAR4FNTAFNTB
SCHEMBL890450 1.00 GPR84 (0.56) GPR84FFAR1FFAR4FNTAFNTB
SCHEMBL3682582 1.00 GPR84 (0.56) GPR84FFAR1FFAR4FNTAFNTB
SCHEMBL139573 1.00 GPR84 (0.56) GPR84FFAR1FFAR4FNTAFNTB
SCHEMBL27617 1.00 GPR84 (0.56) GPR84FFAR1FFAR4FNTAFNTB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9633848-B2 Photosensitive resin composition, method for producing patterned cured film, semiconductor element and electronic device HITACHI CHEMICAL COMPANY, LTD. (JP) 2017-04-25 US disclosed
US-20150325431-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, SEMICONDUCTOR ELEMENT AND ELECTRONIC DEVICE RESONAC CORPORATION (JP) 2015-11-12 US disclosed