SCHEMBL1730116

SCHEMBL1730116

[CH2]C[n+]1ccccc1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1578189 0.85 BCHE (0.50)
Hydrochloric Acid SCHEMBL21293888 0.81 BCHE (0.47)
Hydrochloric Acid SCHEMBL21293887 0.81 BCHE (0.47)
SCHEMBL1446588 0.73
SCHEMBL6115213 0.69 BCHE (0.69)
SCHEMBL10817291 0.69 BCHE (0.65)
SCHEMBL14369259 0.69 BCHE (0.43)
Bromide SCHEMBL11581197 0.67 BCHE (0.71)
SCHEMBL45415 0.65
SCHEMBL13865844 0.65 BCHE (0.39)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 265 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024131536-A1 METAL PLATING COMPOSITION AND USE METHOD THEREFOR 宁波安集微电子科技有限公司 2024-06-27 WO claimed
WO-2024131535-A1 METAL PLATING COMPOSITION AND USE METHOD THEREFOR 宁波安集微电子科技有限公司 2024-06-27 WO claimed
CN-118241266-A Metal electroplating composition and application method thereof 宁波安集微电子科技有限公司 2024-06-25 CN claimed
CN-118241267-A Metal electroplating composition and application method thereof 宁波安集微电子科技有限公司 2024-06-25 CN claimed
CN-117684222-A Metal electroplating composition for electrolytic copper coating and application method thereof 宁波安集微电子科技有限公司 2024-03-12 CN claimed
CN-117684223-A Metal electroplating composition and application method thereof 宁波安集微电子科技有限公司 2024-03-12 CN claimed
WO-2024046447-A1 METAL ELECTROPLATING COMPOSITION FOR ELECTROLYTIC COPPER COATING AND USE METHOD THEREFOR 宁波安集微电子科技有限公司 2024-03-07 WO claimed
CN-112746292-B Chip copper interconnection electroplating additive, preparation method and application thereof 上海新阳半导体材料股份有限公司 2023-04-28 CN claimed
CN-112725851-B Chip copper interconnection electroplating additive, preparation method and application thereof 上海新阳半导体材料股份有限公司 2023-04-28 CN claimed
CN-112725850-B Chip copper interconnection electroplating additive, preparation method and application thereof 上海新阳半导体材料股份有限公司 2023-04-07 CN claimed
US-5001236-A Benzothiazepines MARION LABORATORIES, INC. (US) 1991-03-19 US claimed
US-4963545-A ADMINISTERING CALCIUM ANTAGONIST SUBSTITUTED BENZOTHIAZEPINES MARION LABORATORIES, INC. (US) 1990-10-16 US claimed
EP-0378604-A1 1,1-DIOXO-CEPHEM-4-CARBOTHIOLIC ACID DERIVATIVES. ERBA CARLO SPA (IT) 1990-07-25 EP claimed
WO-1989010926-A1 1,1-DIOXO-CEPHEM-4-CARBOTHIOLIC ACID DERIVATIVES FARMITALIA CARLO ERBA S.R.L. (IT) 1989-11-16 WO claimed
US-4673472-A Method and electroplating solution for deposition of palladium or alloys thereof TECHNIC INC. (US) 1987-06-16 US claimed
EP-0111421-B1 OXACEPHALOSPORIN DERIVATIVES, THEIR PREPARATION AND USE SHIONOGI & CO., LTD. (JP) 1986-08-20 EP claimed
US-4529722-A A 7-ureidoacetamido-7a-methoxy-3-(1-(2-hydroxyethyl)-1H-tetrazol-5 -yl)thiomethyl-1-dethia-1-oxa-3-cephem carboxylic acid derivative SHIONOGI & CO., LTD. (JP) 1985-07-16 US claimed
EP-0111421-A1 Oxacephalosporin derivatives, their preparation and use SHIONOGI & CO., LTD. (JP) 1984-06-20 EP claimed
US-4406755-A Bright palladium electrodeposition TECHNIC INC. (US) 1983-09-27 US claimed
EP-0031708-A2 Cephalosporin derivatives, processes for their manufacture, pharmaceutical compositions containing them and intermediates therefor ICI PHARMA (FR) 1981-07-08 EP claimed