SCHEMBL1742993

SCHEMBL1742993

CC(O)C[N+]1([O-])CCNC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6064715 0.83
SCHEMBL9427337 0.75
SCHEMBL727413 0.72
SCHEMBL1741207 0.72
SCHEMBL4899100 0.70
SCHEMBL367450 0.68
SCHEMBL11593405 0.68
SCHEMBL1788083 0.68
SCHEMBL4893851 0.68 PABPC1 (0.31)
SCHEMBL10630322 0.68

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4396271-A1 COMPOSITION FOR POLYURETHANE FOAM, FOAM PREPARED THEREFROM AND A METHOD THEREOF Momentive Performance Materials Inc. (US) 2024-07-10 EP claimed
WO-2023034354-A1 COMPOSITION FOR POLYURETHANE FOAM, FOAM PREPARED THEREFROM AND A METHOD THEREOF MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2023-03-09 WO claimed
EP-4396271-A1 COMPOSITION FOR POLYURETHANE FOAM, FOAM PREPARED THEREFROM AND A METHOD THEREOF Momentive Performance Materials Inc. (US) 2024-07-10 EP disclosed
WO-2023034354-A1 COMPOSITION FOR POLYURETHANE FOAM, FOAM PREPARED THEREFROM AND A METHOD THEREOF MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2023-03-09 WO disclosed
EP-2146250-B1 WATER-SOLUBLE RESIN COMPOSITION FOR THE FORMATION OF MICROPATTERNS AND PROCESS FOR THE FORMATION OF MICROPATTERNS WITH THE SAME MERCK PATENT GMBH (DE) 2017-08-23 EP disclosed
EP-2389612-A1 A PHOTORESIST IMAGE-FORMING PROCESS USING DOUBLE PATTERNING AZ Electronic Materials USA Corp. (US) 2011-11-30 EP disclosed
WO-2010084372-A1 A PHOTORESIST IMAGE-FORMING PROCESS USING DOUBLE PATTERNING AZ ELECTRONIC MATERIALS USA CORP. (US) 2010-07-29 WO disclosed
US-20100183851-A1 Photoresist Image-forming Process Using Double Patterning CAO YI 2010-07-22 US disclosed
US-20100119717-A1 WATER-SOLUBLE RESIN COMPOSITION FOR THE FORMATION OF MICROPATTERNS AND METHOD FOR THE FORMATION OF MICROPATTERNS WITH THE SAME HONG SUNG-EUN 2010-05-13 US disclosed
EP-2146250-A1 WATER-SOLUBLE RESIN COMPOSITION FOR THE FORMATION OF MICROPATTERNS AND PROCESS FOR THE FORMATION OF MICROPATTERNS WITH THE SAME AZ Electronic Materials (Japan) K.K. (JP) 2010-01-20 EP disclosed