SCHEMBL17433653

SCHEMBL17433653

C1=CC2C3C=CC(C3)C2C1.C=C(C(=O)O)C(OC)OC

nearest known ligand 0.51

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.51

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2223231 0.85 ALDH1A1 (0.56) ALDH1A1
Methacrylic Acid SCHEMBL422384 0.81 ALDH1A1 (0.63) ALDH1A1
Methacrylic Acid SCHEMBL5971154 0.81 ALDH1A1 (0.63) ALDH1A1
SCHEMBL3484584 0.80 ALDH1A1 (0.53) ALDH1A1
Methacrylic Acid SCHEMBL11274732 0.78 ALDH1A1 (0.51) ALDH1A1
Acetic Acid SCHEMBL9331515 0.77 ALDH1A1 (0.73) ALDH1A1
Methoxymethane SCHEMBL282880 0.75 ALDH1A1 (0.83) ALDH1A1
Acrylic Acid SCHEMBL303727 0.75 ALDH1A1 (0.68) ALDH1A1
Acrylic Acid SCHEMBL11287969 0.74 ALDH1A1 (0.49) ALDH1A1
Methyl Alcohol SCHEMBL3242287 0.74 ALDH1A1 (0.86) ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3901966-B1 CONDUCTIVE ADHESIVE SHEET, LAMINATE, AND HEATING DEVICE LINTEC CORP (JP) 2023-09-13 EP disclosed
US-20230249434-A1 SHEET, HEATING ELEMENT, AND HEATING DEVICE LINTEC OF AMERICA, INC. 2023-08-10 US disclosed
US-11723181-B2 Electromagnetic wave absorption film, electromagnetic wave absorption sheet LINTEC CORPORATION (JP) 2023-08-08 US disclosed
US-11654651-B2 Sheet, heating element, and heating device LINTEC CORPORATION (JP) 2023-05-23 US disclosed
US-11535003-B2 Electrically conductive sheet for use in three-dimensional molding LINTEC OF AMERICA, INC. (US) 2022-12-27 US disclosed
EP-4059704-A1 SHEET, HEATING ELEMENT AND HEATING DEVICE LINTEC CORPORATION (JP) 2022-09-21 EP disclosed
US-20220142018-A1 ELECTROMAGNETIC WAVE ABSORPTION FILM, ELECTROMAGNETIC WAVE ABSORPTION SHEET LINTEC CORPORATION (JP) 2022-05-05 US disclosed
US-20220064500-A1 CONDUCTIVE ADHESIVE SHEET, LAMINATE, AND HEATING DEVICE LINTEC CORPORATION (JP) 2022-03-03 US disclosed
EP-3934025-A1 ELECTROMAGNETIC WAVE ABSORPTION FILM, ELECTROMAGNETIC WAVE ABSORPTION SHEET LINTEC CORPORATION (JP) 2022-01-05 EP disclosed
US-20210337632-A1 SHEET-LIKE CONDUCTIVE MEMBER LINTEC CORPORATION (JP) 2021-10-28 US disclosed
EP-3547795-A1 HEAT-GENERATING SHEET FOR THREE-DIMENSIONAL MOLDING AND SURFACE HEAT-GENERATING ARTICLE Lintec of America, Inc. (US) 2019-10-02 EP disclosed
US-20190297677-A1 HEAT-GENERATING SHEET FOR USE IN THREE-DIMENSIONAL MOLDING, AND SURFACE HEAT-GENERATING ARTICLE LINTEC OF AMERICA, INC. 2019-09-26 US disclosed
US-20190297676-A1 ELECTRICALLY CONDUCTIVE SHEET FOR USE IN THREE-DIMENSIONAL MOLDING LINTEC CORPORATION (JP) 2019-09-26 US disclosed
US-20180326697-A1 SHEET, HEATING ELEMENT, AND HEATING DEVICE LINTEC CORPORATION (JP) 2018-11-15 US disclosed
EP-3378640-A1 SHEET, HEATING ELEMENT, AND HEATING DEVICE Lintec of America, Inc. (US) 2018-09-26 EP disclosed
US-9905451-B2 Sheet for semiconductor-related-member processing and method of manufacturing chips using the sheet LINTEC CORPORATION (JP) 2018-02-27 US disclosed
US-20180043659-A1 ADHESIVE SHEET LINTEC OF AMERICA, INC. (US) 2018-02-15 US disclosed
EP-3263330-A1 ADHESIVE SHEET Lintec of America, Inc. (US) 2018-01-03 EP disclosed
US-20160372358-A1 SHEET FOR SEMICONDUCTOR-RELATED-MEMBER PROCESSING AND METHOD OF MANUFACTURING CHIPS USING THE SHEET LINTEC CORPORATION (JP) 2016-12-22 US disclosed
EP-2975098-A1 ADHESIVE SHEET, AND PRODUCTION METHOD FOR PROCESSED DEVICE-RELATED MEMBERS Lintec Corporation (JP) 2016-01-20 EP disclosed