SCHEMBL17445593

SCHEMBL17445593

Nc1nnc(SCCC(=O)OCC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(C(F)(F)F)C(F)(F)F)s1

nearest known ligand 0.43

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 8/20 0.43
HTT P42858 2/20 0.41
KDM4E B2RXH2 1/20 0.40
TP53 P04637 2/20 0.38
SMN1; SMN2 Q16637 2/20 0.38
LMNA P02545 1/20 0.38
HPGD P15428 1/20 0.38
APEX1 P27695 1/20 0.37
MAPT P10636 1/20 0.36
NPC1 O15118 1/20 0.35
TSHR P16473 1/20 0.35
RAB9A P51151 1/20 0.35
POLB P06746 1/20 0.35
MEN1 O00255 1/20 0.35
KMT2A Q03164 1/20 0.35
TDP1 Q9NUW8 1/20 0.35
L3MBTL1 Q9Y468 1/20 0.35
HSD17B10 Q99714 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16883837 0.88 APEX1 (0.36) ALDH1A1KDM4ESMN1; SMN2APEX1NPC1
SCHEMBL17109951 0.78 APEX1 (0.35) ALDH1A1KDM4ESMN1; SMN2APEX1TDP1
SCHEMBL16883838 0.78 APEX1 (0.35) ALDH1A1KDM4ESMN1; SMN2APEX1NPC1
SCHEMBL17109952 0.78 APEX1 (0.35) ALDH1A1KDM4ESMN1; SMN2APEX1NPC1
SCHEMBL17109958 0.75 PTGS1 (0.34) ALDH1A1KDM4ESMN1; SMN2APEX1NPC1
SCHEMBL1241817 0.75 ALDH1A1 (0.74) ALDH1A1HTTKDM4ETP53SMN1; SMN2
SCHEMBL19757402 0.73 APEX1 (0.40) ALDH1A1HTTKDM4ESMN1; SMN2LMNA
SCHEMBL17109955 0.73 APEX1 (0.37) ALDH1A1HTTKDM4ESMN1; SMN2HPGD
SCHEMBL17446991 0.72 ALDH1A1 (0.56) ALDH1A1HTTTP53SMN1; SMN2LMNA
SCHEMBL17445589 0.72 APEX1 (0.34) ALDH1A1KDM4ESMN1; SMN2APEX1TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9859036-B2 Conductive film forming composition, conductive film, and wiring board FUJIFILM CORPORATION (JP) 2018-01-02 US disclosed
US-20160021741-A1 CONDUCTIVE FILM FORMING COMPOSITION, CONDUCTIVE FILM, AND WIRING BOARD FUJIFILM CORPORATION (JP) 2016-01-21 US disclosed